Semiconductor device having inverter circuit with terminal electrically connected to transistor that includes oxide semiconductor material

ABSTRACT

One object is to provide a new semiconductor device whose standby power is sufficiently reduced. The semiconductor device includes a first power supply terminal, a second power supply terminal, a switching transistor using an oxide semiconductor material and an integrated circuit. The first power supply terminal is electrically connected to one of a source terminal and a drain terminal of the switching transistor. The other of the source terminal and the drain terminal of the switching transistor is electrically connected to one terminal of the integrated circuit. The other terminal of the integrated circuit is electrically connected to the second power supply terminal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.12/962,929, filed Dec. 8, 2010, now pending, which claims the benefit ofa foreign priority application filed in Japan as Serial No. 2009-281949on Dec. 11, 2009, both of which are incorporated by reference.

TECHNICAL FIELD

The technical field of the disclosed invention relates to asemiconductor device using an oxide semiconductor. The semiconductordevice in this specification indicates all the devices that operate byutilizing semiconductor characteristics. For example, a semiconductordevice widely includes the following elements: a semiconductor element(including a so-called power device) such as a transistor, a diode and athyristor, an integrated circuit such as an image sensor, a memory and aconverter, an integrated circuit including the above elements and adisplay device and the like typified by a liquid crystal display device.

BACKGROUND ART

A CMOS circuit is a necessary component for a semiconductor integratedcircuit because a CMOS circuit has low power consumption and can operateat high speed and can be highly integrated. On the other hand, in recentyears, in accordance with miniaturization of a MOS transistor, anincrease of power consumption at the time when an increase of powerconsumption in a non operating state (power consumption in a standbyperiod, hereinafter also referred to as standby power) due to anincrease of leakage current (also referred to as off state current,subthreshold current or the like) has been a problem. For example, in asilicon MOS transistor whose channel length is miniaturized toapproximately 0.1 μm or less, the value of drain current cannot be madezero when a potential between a gate and a source is set to thresholdvoltage or less.

To prevent an increase of the standby power due to the leakage current,a technique using a switching transistor has been proposed (for example,see Patent Document 1). The technique disclosed in Patent Document 1 isas follows: a switching transistor having small leakage current comparedto a CMOS circuit is provided between a power supply and the CMOScircuit; the switching transistor is turned off when the CMOS circuit isnot in operation so that standby power is decreased.

REFERENCE

-   [Patent Document 1] Japanese Published Patent Application No.    H5-210976

DISCLOSURE OF INVENTION

Standby power depends on the leakage current of the switching transistorin the technique disclosed in Patent Document 1. That is, standby powercan be sufficiently reduced by sufficiently reducing the leakage currentof the switching transistor.

In contrast to this, sufficient current is needed for operating a CMOScircuit to secure appropriate operation of a CMOS circuit. Therefore, inthe case where the switching transistor in the technique disclosed inPatent Document 1 is provided, the channel width of the switchingtransistor needs to be equivalent to or more than that of a transistorincluded in a CMOS circuit, in order to supply sufficient current to aCMOS circuit and secure operation of a CMOS circuit.

In view of the above problems, a method for suppressing the leakagecurrent of a switching transistor itself by making the channel width ofthe switching transistor smaller than that of a transistor included inan integrated circuit is not practical.

Thus, it is difficult to make standby power of a CMOS circuitsubstantially zero in the technique disclosed in Patent Document 1.Thus, there is a problem in that a slight amount of standby power ofeach circuit included in an integrated circuit accumulates to be a largeamount of standby power in an integrated circuit including a group of anumber of circuits or the like.

In view of the above problems, one object of the present invention is toprovide a new semiconductor device whose standby power is sufficientlyreduced.

In the disclosed invention, a semiconductor device (for example, atransistor) is formed using a highly purified oxide semiconductor. Theleakage current of the transistor formed using a highly purified oxidesemiconductor is extremely small, so that on/off ratio can besufficiently increased. In other words, the leakage current of thetransistor can be kept at extremely low level even when current drivecapability of the transistor is sufficiently secured.

The above-described oxide semiconductor is used for the followingstructure, whereby standby power of a semiconductor device can besufficiently suppressed.

For example, one embodiment of the disclosed invention is asemiconductor device including a first power supply terminal, a secondpower supply terminal, a switching transistor including an oxidesemiconductor material and an integrated circuit. The first power supplyterminal is electrically connected to one of a source terminal and adrain terminal of the switching transistor. The other of the sourceterminal and the drain terminal of the switching transistor iselectrically connected to one terminal of the integrated circuit. Theother terminal of the integrated circuit is electrically connected tothe second power supply terminal.

In addition, another embodiment of the disclosed invention is asemiconductor device including a first power supply terminal, a secondpower supply terminal, a switching transistor including an oxidesemiconductor material and having a first control terminal and a secondcontrol terminal and an integrated circuit. The first power supplyterminal is electrically connected to one of a source terminal and adrain terminal of the switching transistor. The other of the sourceterminal and the drain terminal of the switching transistor iselectrically connected to one terminal of the integrated circuit. Theother terminal of the integrated circuit is electrically connected tothe second power supply terminal.

The switching transistor may include an oxide semiconductor layerincluding an oxide semiconductor material, a gate electrode for applyingan electric field to the oxide semiconductor layer, a gate insulatinglayer interposed between the oxide semiconductor layer and the gateelectrode, and a source electrode and a drain electrode electricallyconnected to the oxide semiconductor layer. In addition, a gateelectrode for controlling the threshold voltage of the switchingtransistor may also be included in the switching transistor. Here, thegate electrode corresponds to a control terminal, the source electrodecorresponds to a source terminal and the drain electrode corresponds toa drain terminal. Note that each electrode does not need to be the sameas each terminal unless circuit operation is prevented. For example,some kind of element (such as a wiring, a switching element, a resistor,an inductor, a capacitor, an element having other various functions) isconnected between an electrode (for example, a source electrode) and aterminal (for example, a source terminal) in some cases.

Further, the oxide semiconductor material may be an In—Ga—Zn—O-basedoxide semiconductor material.

Furthermore, leakage current of the switching transistor can be 1×10⁻¹³A or less.

Moreover, the integrated circuit can be formed using a semiconductormaterial other than an oxide semiconductor material. The semiconductormaterial other than an oxide semiconductor material can be silicon.

The integrated circuit includes a CMOS circuit.

Note that in this specification, the terms “over” and “below” do notnecessarily mean “directly on” and “directly under”, respectively, inthe description of a physical relationship between components. Forexample, the expression of “a gate electrode over a gate insulatinglayer” may refer to the case where another component is interposedbetween the gate insulating layer and the gate electrode. In addition,the terms “above” and “below” are just used for convenience ofexplanations and they can be interchanged unless otherwise specified.

In this specification, the terms “electrode” and “wiring” does not limitthe function of components. For example, an “electrode” can be used as apart of “wiring”, and the “wiring” can be used as a part of the“electrode”. In addition, the terms “electrode” and “wiring” can alsomean a combination of a plurality of “electrodes” and “wirings”, forexample.

Further, functions of a “source” and a “drain” might be switched whentransistors having different polarities are employed or a direction ofcurrent flow is changed in circuit operation, for example. Therefore,the terms “source” and “drain” can be switched in this specification.

Note that in this specification, the expression of “electricallyconnected” includes the case of electrical connection through “an objecthaving any electrical function”. Here, there is no particular limitationon “an object having any electrical function” as long as the objectenables transmission and reception of an electrical signal betweencomponents which the object connects.

For example, in “an object having any electrical function”, a switchingelement such as a transistor, a resistor, an inductor, a capacitor, andother elements having several functions, are included, as well aselectrodes and wirings.

In the disclosed invention, a highly purified oxide semiconductor isused for a semiconductor device. “Highly purified” is a conceptincluding at least one of the following: to remove hydrogen in an oxidesemiconductor from the oxide semiconductor layer as much as possible; orto supply oxygen, which is in short supply in an oxide semiconductor,into the oxide semiconductor so that defect level in energy gap due tooxygen deficiency in the oxide semiconductor is reduced.

An oxide semiconductor layer is highly purified as described above to bean intrinsic (i-type) oxide semiconductor. An oxide semiconductor is ann-type semiconductor in general, whereby the leakage current of atransistor using an oxide semiconductor is increased. In the disclosedone embodiment of the invention, an oxide semiconductor is highlypurified to be an i-type oxide semiconductor or close to an i-type oxidesemiconductor in order to reduce leakage current sufficiently.

In addition, at least part of a semiconductor device is formed includingthe highly purified oxide semiconductor as described above, so that asemiconductor device whose standby power is sufficiently reduced can berealized. It can be said that effect of the suppression of standby powerincreases as a circuit becomes complicated.

BRIEF DESCRIPTION OF DRAWINGS

In the accompanying drawings:

FIGS. 1A and 1B are circuit diagrams relating to an example of asemiconductor device;

FIG. 2A is a cross-sectional view and FIG. 2B is a plan view eachrelating to an example of a semiconductor device;

FIGS. 3A to 3H are cross-sectional views relating to manufacturing stepsof a semiconductor device;

FIGS. 4A to 4G are cross-sectional views relating to manufacturing stepsof a semiconductor device;

FIGS. 5A to 5D are cross-sectional views relating to manufacturing stepsof a semiconductor device;

FIGS. 6A and 6B are circuit diagrams relating to an example of asemiconductor device;

FIG. 7 is a cross-sectional view relating to an example of asemiconductor device;

FIG. 8 is a block diagram relating to an example of a semiconductordevice;

FIGS. 9A to 9E are cross-sectional views relating to manufacturing stepsof a semiconductor device;

FIGS. 10A to 10E are cross-sectional views relating to manufacturingsteps of a semiconductor device; and

FIGS. 11A to 11F are diagrams for explaining electronic appliances.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described withreference to the drawings. Note that the present invention is notlimited to the following description and it will be readily appreciatedby those skilled in the art that modes and details can be modified invarious ways without departing from the spirit and the scope of thepresent invention. Therefore, the present invention should not beinterpreted as being limited to the description of the followingembodiments.

Note that for the easy understanding, the position, size, range and thelike of each component illustrated in the drawings are not actual onesin some cases. Therefore, the present invention is not limited to theposition, size, range and the like disclosed in the drawings.

Note that in this specification, ordinal numbers such as “first”,“second”, and “third” are used in order to avoid confusion amongcomponents, and the terms do not limit the components numerically.

Embodiment 1

In this embodiment, a structure and a manufacturing method of asemiconductor device according to one embodiment of the presentinvention disclosed will be described with reference to FIGS. 1A and 1B,FIGS. 2A and 2B, FIGS. 3A to 3H, FIGS. 4A to 4G and FIGS. 5A to 5D. Notethat in a circuit diagram, “OS” is written beside a transistor in orderto indicate that the transistor includes an oxide semiconductor.

<Circuit Configuration and Operation of Semiconductor Device>

FIGS. 1A and 1B show an example of a circuit configuration of asemiconductor device. FIG. 1A is an example of a semiconductor deviceusing a CMOS inverter circuit which is the simplest CMOS circuit. FIG.1B is an example of a semiconductor device having a plurality of CMOSinverter circuits.

A semiconductor device shown in FIG. 1A includes a power supply terminalVH, a power supply terminal VL, a switching transistor S1 using an oxidesemiconductor material and a CMOS inverter circuit C1. The switchingtransistor S1 is typically an n-channel transistor using an oxidesemiconductor. In addition, a high potential is supplied to the powersupply terminal VH and a low potential is supplied to the power supplyterminal VL.

Here, the power supply terminal VH is electrically connected to a sourceterminal of a p-channel transistor in the CMOS inverter circuit C1. Adrain terminal of the p-channel transistor in the CMOS inverter circuitC1 and a drain terminal of an n-channel transistor in the CMOS invertercircuit C1 are electrically connected to each other and are connected toan output terminal OUT of the CMOS inverter circuit C1. A sourceterminal of the re-channel transistor in the CMOS inverter circuit C1 iselectrically connected to a drain terminal of the switching transistorS1. A source terminal of the switching transistor S1 is electricallyconnected to the power supply terminal VL. In addition, a gate terminalof the p-channel transistor in the CMOS inverter circuit C1 and a gateterminal of the n-channel transistor in the CMOS inverter circuit C1 areelectrically connected to each other and are connected to an inputterminal IN of the CMOS inverter circuit C1.

When the semiconductor device operates, a high potential is input to acontrol terminal S_IN of the switching transistor S1 and the switchingtransistor S1 turns on. In this state, when either a high potential or alow potential is input to the input terminal IN, a high potential or alow potential corresponding to the potential is output from the outputterminal OUT. For example, when a high potential is input to the inputterminal IN, the p-channel transistor in the CMOS inverter circuit C1turns off and the n-channel transistor in the CMOS inverter circuit C1turns on, so that the CMOS inverter circuit C1 outputs a low potentialcorresponding to the potential supplied to the power supply terminal VL.When a low potential is input to the input terminal IN, the p-channeltransistor in the CMOS inverter circuit C1 turns on and the n-channeltransistor in the CMOS inverter circuit C1 turns off, so that the CMOSinverter circuit C1 outputs a high potential corresponding to thepotential supplied to the power supply terminal VH.

When the semiconductor device does not operate, a low potential is inputto the control terminal S_IN of the switching transistor S1 and theswitching transistor S1 turns off. Current which flows in the CMOSinverter circuit C1 (leakage current) is controlled by the combinedresistance of the CMOS inverter circuit C1 and the switching transistorS1, whereby power consumption (power consumption in a standby period,hereinafter also referred to as standby power) can be sufficientlyreduced by sufficiently increasing the off state resistance of theswitching transistor S1 and sufficiently reducing the leakage current ofthe switching transistor S1.

A transistor using an oxide semiconductor material has a characteristicof a significantly small off state current. For example, the carrierdensity of a sufficiently intrinsic oxide semiconductor is less than1×10¹²/cm³, preferably less than 1.45×10¹⁰/cm³. The off state current ofa transistor is 1×10⁻¹³ A or less for example, in the case where thedrain voltage Vd is +1 V or +10 V and the gate voltage Vg is in therange of −5 V to −20 V. Therefore, by forming the switching transistorS1 using an oxide semiconductor, the leakage current of thesemiconductor device can be sufficiently reduced. Further, in the casewhere an oxide semiconductor which is sufficiently intrinsic is used,leakage current at room temperature can be reduced from approximately1×10⁻²⁰ A (10 zA (zeptoampere)) to 1×10⁻¹⁹ A (100 zA). That is, leakagecurrent can even be reduced to substantially zero. The amount of theleakage current does not change even in the case where the channel widthof the switching transistor S1 is relatively large. In other words, by atransistor using an oxide semiconductor, sufficient current drivecapability can be secured and the leakage current can be reduced byreducing the power consumption of the semiconductor device.

A semiconductor device shown in FIG. 1B corresponds to the semiconductordevice shown in FIG. 1A in which the CMOS inverter circuit C1 isreplaced with a plurality of CMOS inverter circuits C1 to Cn.

That is, the semiconductor device shown in FIG. 1B includes a powersupply terminal VH, a power supply terminal VL, a switching transistorS1 using an oxide semiconductor material and CMOS inverter circuits C1to Cn (also simply referred to as an integrated circuit). In addition,each of the CMOS inverter circuits includes input terminals I1 to In andoutput terminals O1 to On. The connection relations of each element arethe same as that of FIG. 1A. A difference between FIGS. 1A and 1B isthat the plurality of CMOS inverter circuits C1 to Cn is connected toeach other in parallel and each of the CMOS inverter circuits isconnected to the power supply terminal VH and the switching transistorS1 in FIG. 1B. When a circuit including the plurality of CMOS invertercircuits C1 to Cn connected to each other in parallel is assumed to beone integrated circuit, it can be said that a drain terminal of theswitching transistor S1 is electrically connected to one terminal of theintegrated circuit and the other terminal of the integrated circuit iselectrically connected to the power supply terminal VH.

The operation of the circuits is also the same as that of FIG. 1A. Notethat a potential is input to each of the input terminals and a potentialcorresponding to the input potential is output from each of the outputterminals in FIG. 1B, which is different from that of FIG. 1A.

In the above manner, a semiconductor device whose standby power issufficiently reduced is realized by using an oxide semiconductor,particularly, a highly purified oxide semiconductor for at least as apart of the semiconductor device. In conventional techniques, it isdifficult to reduce leakage current to a value which can be consideredsubstantially zero (for example, 1×10⁻¹³ A or less) while appropriateoperation of the semiconductor device is secured. On the other hand, thepresent invention can realize this. In this regard, the presentinvention is excellent. Specifically, in a circuit in which a number ofcircuits is integrated and is complicated, the total amount of standbypower is large even if the amount of standby power of each circuit isslight. Therefore, effect of reducing the value of standby power tosubstantially zero is more noticeable as a circuit is integrated andcomplicated.

Note that an example of a semiconductor device using a CMOS invertercircuit is described here, but the disclosed invention is not limitedthereto. One embodiment of the disclosed invention can be used for anycircuit (an integrated circuit) which has a problem with powerconsumption when a circuit is not in operation.

In addition, although the case where the n-channel switching transistorS1 is used is described above, it is apparent that a p-channeltransistor can be used as the switching transistor S1. In this case, itis preferable that the switching transistor S1 be electrically connectedto the p-channel transistor in the CMOS inverter circuit, for example.

<Planar Structure and Cross-Sectional Structure of Semiconductor Device>

FIGS. 2A and 2B are an example of a structure of the semiconductordevice shown in FIG. 1A. FIG. 2A shows a cross section of thesemiconductor device and FIG. 2B shows a plan of the semiconductordevice. Here, FIG. 2A corresponds to a cross section taken along lineA1-A2-A3 in FIG. 2B. The semiconductor device shown in FIGS. 2A and 2Bincludes a transistor 160 (a transistor included in a CMOS invertercircuit C1) using a material other than oxide semiconductor in a lowerportion, and a transistor 162 (a transistor functioning as the switchingtransistor S1) using an oxide semiconductor in an upper portion. Notethat the transistors 160 and 162 are both described as n-channeltransistors. However, of course, both a p-channel transistor and ann-channel transistor are used in a CMOS inverter circuit. Further, atechnical idea of the disclosed invention is to use a transistor usingoxide semiconductor as a switching transistor in order to reduce powerconsumption; thus, a specific structure of the semiconductor device isnot limited to the structure described here.

The transistor 160 includes a channel formation region 116 provided in asubstrate 100 including a semiconductor material, impurity regions 114and high-concentration impurity regions 120 (these regions can becollectively referred to simply as impurity regions) provided so as tosandwich the channel formation region 116, a gate insulating layer 108provided over the channel formation region 116, a gate electrode 110provided over the gate insulating layer 108 and a source electrode ordrain electrode 130 a and a source or drain electrode 130 b both ofwhich are electrically connected to the impurity regions 114.

Sidewall insulating layers 118 are provided on side surfaces of the gateelectrode 110. Moreover, as shown in the plan view, thehigh-concentration impurity regions 120 are provided in a region of thesubstrate 100 which does not overlap with the side wall insulatinglayers 118, and metal compound regions 124 are present over thehigh-concentration impurity regions 120. An element isolation insulatinglayer 106 is provided over the substrate 100 so as to surround thetransistor 160. An interlayer insulating layer 126 and an interlayerinsulating layer 128 are provided so as to cover the transistor 160. Thesource or drain electrode 130 a and the source or drain electrode 130 bare electrically connected to the metal compound regions 124 throughopenings formed in the interlayer insulating layer 126 and theinterlayer insulating layer 128. That is, the source or drain electrode130 a and the source or drain electrode 130 b are electrically connectedto the high-concentration impurity regions 120 and the impurity regions114 through the metal compound regions 124.

The transistor 162 includes a gate electrode 136 c provided over theinterlayer insulating layer 128, a gate insulating layer 138 providedover the gate electrode 136 c, an oxide semiconductor layer 140 providedover the gate insulating layer 138 and a source or drain electrode 142 aand a source or drain electrode 142 b both of which are provided overthe oxide semiconductor layer 140 and electrically connected to theoxide semiconductor layer 140.

Here, the gate electrode 136 c is formed so as to be embedded in aninsulating layer 132 provided over the interlayer insulating layer 128.Like the gate electrode 136 c, an electrode 136 a and an electrode 136 bare formed in contact with the source or drain electrode 130 a and thesource or drain electrode 130 b, respectively.

A protective insulating layer 144 is provided over the transistor 162 soas to be in contact with part of the oxide semiconductor layer 140. Aninterlayer insulating layer 146 is provided over the protectiveinsulating layer 144. Here, the protective insulating layer 144 and theinterlayer insulating layer 146 are provided with openings reaching thesource or drain electrode 142 a and the source or drain electrode 142 b.An electrode 150 c and an electrode 150 d are in contact with the sourceor drain electrode 142 a and the source or drain electrode 142 b throughthe openings. Like the electrode 150 c and the electrode 150 d, anelectrode 150 a and an electrode 150 b are formed in contact with theelectrode 136 a and the electrode 136 b, respectively, through openingsin the gate insulating layer 138, the protective insulating layer 144and the interlayer insulating layer 146.

Here, the oxide semiconductor layer 140 is preferably a highly purifiedoxide semiconductor layer by sufficiently removing impurities such ashydrogen or sufficiently supplying oxygen. Specifically, the hydrogenconcentration of the oxide semiconductor layer 140 is 5×10¹⁹ atoms/cm³or less, preferably 5×10¹⁸ atoms/cm³ or less, and more preferably 5×10¹⁷atoms/cm³ or less. The carrier concentration of the oxide semiconductorlayer 140 which is highly purified and the hydrogen concentration ofwhich is sufficiently reduced and defect level in energy gap due tooxygen deficiency is reduced by sufficiently supplying oxygen is asfollows: less than 1×10¹²/cm³, preferably less than 1×10¹¹/cm³, morepreferably less than 1.45×10¹⁰/cm³. For example, when the drain voltageVd is +1 V or +10 V and the gate voltage Vg ranges from ˜20 V to ˜5 V,the off state current is 1×10⁻¹³ A or less. In addition, the off stateresistivity is 1×10⁹ Ω·m or more, preferably 1×10¹⁰ Ω·m or more. Thetransistor 162 with very excellent off current characteristics can beobtained with the use of such an oxide semiconductor that is highlypurified to be intrinsic (i-type) or substantially intrinsic (i-type).Note that the hydrogen concentration in the oxide semiconductor layer140 is measured by secondary ion mass spectrometry (SIMS).

Furthermore, the insulating layer 152 is provided over the interlayerinsulating layer 146. The electrode 154 a, the electrode 154 b and theelectrode 154 c are provided so as to be embedded in the insulatinglayer 152. Here, the electrode 154 a is in contact with the electrode150 a, the electrode 154 b is in contact with the electrodes 150 b and150 c and the electrode 154 c is in contact with the electrode 150 d.

That is, in the semiconductor device shown in FIGS. 2A and 2B, thesource or drain electrode 130 b of the transistor 160 is electricallyconnected to the source or drain electrode 142 a of the transistor 162through the electrode 136 b, the electrode 150 b, the electrode 154 band the electrode 150 c.

<Method for Manufacturing Semiconductor Device>

Next, an example of the manufacturing method of the above semiconductordevice will be described. First, a method for manufacturing thetransistor 160 in the lower portion will be described below withreference to FIGS. 3A to 3H, and then a method for manufacturing thetransistor 162 in the upper portion will be described with reference toFIGS. 4A to 4G and FIGS. 5A to 5D.

<Method for Manufacturing Transistor in Lower Portion>

First, the substrate 100 containing a semiconductor material is prepared(see FIG. 3A). As the substrate 100 containing a semiconductor material,a single crystal semiconductor substrate or a polycrystallinesemiconductor substrate containing silicon, silicon carbide or the like,a compound semiconductor substrate containing silicon germanium or thelike, an SOT substrate or the like can be used. Here, an example inwhich a single crystal silicon substrate is used as the substrate 100containing a semiconductor material is described. Note that in general,the term “SOI substrate” means a substrate having a siliconsemiconductor layer over an insulating surface. In this specification,the term “SOI substrate” also means a substrate having a semiconductorlayer using a material other than silicon over an insulating surface.That is, a semiconductor layer included in the “SOT substrate” is notlimited to a silicon semiconductor layer. In addition, the SOT substrateincludes a substrate having a semiconductor layer over its insulatingsubstrate such as a glass substrate, with an insulating layer betweenthe semiconductor layer and the insulating substrate.

Over the substrate 100, a protective layer 102 which functions as a maskfor forming an element isolation insulating layer is formed (see FIG.3A). As the protective layer 102, for example, an insulating layerformed using silicon oxide, silicon nitride, silicon oxynitride or thelike can be used. Note that an impurity element giving n-typeconductivity or an impurity element giving p-type conductivity may beadded to the substrate 100 before or after the above step to control thethreshold voltage of the transistor. As the impurity giving n-typeconductivity, phosphorus, arsenic or the like can be used when thesemiconductor is silicon. As the impurity giving p-type conductivity,boron, aluminum, gallium, or the like can be used, for example.

Next, part of the substrate 100 in a region which is not covered withthe protective layer 102 (an exposed region) is removed by etching withthe use of the protective layer 102 as a mask. Thus, a semiconductorregion 104 which is separated is formed (see FIG. 3B). For the etching,dry etching is preferably performed, but wet etching may also beperformed. An etching gas and an etchant can be selected as appropriatedepending on a material of the object to be etched.

Next, an insulating layer is formed so as to cover the semiconductorregion 104 and is selectively removed in a region which overlaps withthe semiconductor region 104, whereby the element isolation insulatinglayer 106 is formed (see FIG. 3B). The insulating layer is formed usingsilicon oxide, silicon nitride, silicon oxynitride or the like. As amethod for removing the insulating layer, there are etching treatmentand polishing treatment such as CMP, and any of them can be employed.Note that the protective layer 102 is removed either after thesemiconductor region 104 is formed or after the element isolationinsulating layer 106 is formed.

Then, an insulating layer is formed over the semiconductor region 104and a layer containing a conductive material is formed over theinsulating layer.

The insulating layer serves as a gate insulating layer later andpreferably has a single-layer structure or a stacked-layer structure ofa film containing silicon oxide, silicon oxynitride, silicon nitride,hafnium oxide, aluminum oxide, tantalum oxide or the like obtained byusing a CVD method, a sputtering method or the like. Alternatively, theabove insulating layer may be obtained by oxidizing or nitriding asurface of the semiconductor region 104 by high-density plasma treatmentor thermal oxidation treatment. The high-density plasma treatment can beperformed using, for example, a mixed gas of a rare gas such as He, Ar,Kr or Xe and oxygen, nitrogen oxide, ammonia, nitrogen or hydrogen.There is no particular limitation on the thickness of the insulatinglayer, but the thickness can be 1 nm or more and 100 nm or less, forexample.

The layer containing a conductive material can be formed using a metalmaterial such as aluminum, copper, titanium, tantalum, or tungsten.Alternatively, the layer containing a conductive material may be formedusing a semiconductor material such as polycrystalline siliconcontaining a conductive material. There is also no particular limitationon a method for forming the layer containing a conductive material, andany of a variety of film formation methods such as an evaporationmethod, a CVD method, a sputtering method and a spin coating method isapplicable. Note that in this embodiment, an example of the case wherethe layer containing a conductive material is formed using a metalmaterial is described.

After that, by selectively etching the insulating layer and the layercontaining a conductive material, the gate insulating layer 108 and thegate electrode 110 are formed (see FIG. 3C).

Next, an insulating layer 112 which covers the gate electrode 110 isformed (see FIG. 3C). Phosphorus (P), arsenic (As) or the like is thenadded to the semiconductor region 104, whereby the impurity regions 114with a shallow junction depth in the substrate 100 are formed (see FIG.3C). Note that although phosphorus or arsenic is added here so that ann-channel transistor is formed, an impurity element such as boron (B) oraluminum (Al) may be added in the case of forming a p-channeltransistor. The channel formation region 116 is formed in thesemiconductor region 104 below the gate insulating layer 108 byformation of the impurity regions 114 (see FIG. 3C). Here, theconcentration of the added impurity can be set as appropriate; in thecase where a semiconductor element is highly miniaturized, theconcentration is preferably set to be high. Further, a process in whichthe insulating layer 112 is formed after formation of the impurityregions 114 may be employed instead of the process employed here inwhich the impurity regions 114 are formed after formation of theinsulating layer 112.

Then, the sidewall insulating layers 118 are formed (see FIG. 3D). Aninsulating layer is formed so as to cover the insulating layer 112 andthen is subjected to highly anisotropic etching treatment, whereby thesidewall insulating layers 118 can be formed in a self-aligned manner.It is preferable that the insulating layer 112 be partly etched at thistime so that a top surface of the gate electrode 110 and top surfaces ofthe impurity regions 114 are exposed.

After that, an insulating layer is formed so as to cover the gateelectrode 110, the impurity regions 114, the side wall insulating layers118 and the like. Phosphorus (P), arsenic (As), or the like is thenadded to regions where the gate insulating layer is in contact with theimpurity regions 114, whereby the high-concentration impurity regions120 are formed (see FIG. 3E). Next, the above insulating layer isremoved and a metal layer 122 is formed so as to cover the gateelectrode 110, the sidewall insulating layers 118, thehigh-concentration impurity regions 120 and the like (see FIG. 3E). Anyof a variety of film formation methods such as a vacuum evaporationmethod, a sputtering method and a spin coating method is applicable toformation of the metal layer 122. It is preferable that the metal layer122 be formed using a metal material that reacts with a semiconductormaterial included in the semiconductor region 104 so as to form a metalcompound having low resistance. Examples of such a metal materialinclude titanium, tantalum, tungsten, nickel, cobalt and platinum.

Next, heat treatment is performed, whereby the metal layer 122 reactswith the semiconductor material. Consequently, the metal compoundregions 124 which are in contact with the high-concentration impurityregions 120 are formed (see FIG. 3F). Note that, in the case of usingpolycrystalline silicon for the gate electrode 110, a portion of thegate electrode 110 which is in contact with the metal layer 122 also hasthe metal compound region.

For the heat treatment, irradiation with a flash lamp can be used.Although it is needless to say that another heat treatment method may beused, a method by which heat treatment for an extremely short time canbe achieved is preferably used in order to improve the controllabilityof chemical reaction in formation of the metal compound. Note that theabove described metal compound regions are formed through reaction ofthe metal material with the semiconductor material and have sufficientlyhigh conductivity. By formation of the metal compound regions, electricresistance can be sufficiently reduced and element characteristics canbe improved. The metal layer 122 is removed after formation of the metalcompound regions 124.

The interlayer insulating layers 126 and 128 are formed so as to coverthe components formed in the above steps (see FIG. 3G). The interlayerinsulating layers 126 and 128 can be formed using a material containingan inorganic insulating material such as silicon oxide, siliconoxynitride, silicon nitride, hafnium oxide, aluminum oxide or tantalumoxide. Alternatively, an organic insulating material such as polyimideor acrylic can be used. Note that although a two-layer structure hasbeen employed with the interlayer insulating layer 126 and theinterlayer insulating layer 128 here, the structure of the interlayerinsulating layers is not limited to this. A surface of the interlayerinsulating layer 128 is preferably subjected to CMP, etching treatmentor the like so as to be flattened after the interlayer insulating layer128 is formed.

Then, openings reaching the metal compound regions 124 are formed in theinterlayer insulating layers, and then the source or drain electrode 130a and the source or drain electrode 130 b are formed in the openings(see FIG. 3H). For example, the source or drain electrode 130 a and thesource or drain electrode 130 b can be formed as follows: a conductivelayer is formed in a region including the openings by a PVD method, aCVD method or the like; and then, part of the conductive layer isremoved by etching treatment, CMP or the like.

Note that in the case of forming the source or drain electrode 130 a andthe source or drain electrode 130 b by removing part of the conductivelayer, surfaces thereof are preferably processed to be flat. Forexample, in the case where a titanium film, a titanium nitride film orthe like is formed to have a small thickness in the region including theopenings and a tungsten film is then formed so as to fill the openings,CMP which is performed after that can remove an unnecessary portion ofthe tungsten film, titanium film, titanium nitride film or the like, andimprove the flatness of the surfaces. By flattening surfaces includingthe surfaces of the source or drain electrode 130 a and the source ordrain electrode 130 b as described above, favorable electrodes, wirings,insulating layers, semiconductor layers or the like can be formed in asubsequent step.

Note that although only the source or drain electrode 130 a and thesource or drain electrode 130 b which are in contact with the metalcompound regions 124 are described, an electrode which is in contactwith the gate electrode 110 and the like can be formed in the same step.There is no particular limitation on a material used for the source ordrain electrode 130 a and the source or drain electrode 130 b and any ofa variety of conductive materials can be used. For example, a conductivematerial such as molybdenum, titanium, chromium, tantalum, tungsten,aluminum, copper, neodymium or scandium can be used.

Through the above process, the transistor 160 including the substrate100 containing a semiconductor material is formed. Note that electrodes,wirings, insulating layers or the like may be formed as well after theabove process is performed. When a multilayer wiring structure in whichan interlayer insulating layer and a conductive layer are stacked isemployed as a wiring structure, a highly-integrated semiconductor devicecan be provided.

<Method for Manufacturing Transistor in Upper Portion>

Next, a process through which the transistor 162 is manufactured overthe interlayer insulating layer 128 is described with reference to FIGS.4A to 4G and FIGS. 5A to 5D. Note that the transistor 160 and the likebelow the transistor 162 are omitted in FIGS. 4A to 4G and FIGS. 5A to5D, which illustrate a manufacturing process of a variety of electrodesover the interlayer insulating layer 128, the transistor 162 and thelike.

First, the insulating layer 132 is formed over the interlayer insulatinglayer 128, the source or drain electrode 130 a and the source or drainelectrode 130 b (see FIG. 4A). The insulating layer 132 can be formed bya PVD method, a CVD method or the like. A material containing aninorganic insulating material such as silicon oxide, silicon oxynitride,silicon nitride, hafnium oxide, aluminum oxide or tantalum oxide can beused for the insulating layer 132.

Next, openings reaching the source or drain electrode 130 a and thesource or drain electrode 130 b are formed in the insulating layer 132.At this time, another opening is formed in a region where the gateelectrode 136 c is to be formed. A conductive layer 134 is formed so asto fill the openings (see FIG. 4B). The above openings can be formed byetching with the use of a mask, for example. The mask can be formed byexposure using a photomask, for example. For the etching, either wetetching or dry etching may be performed but dry etching is preferable inview of the fine patterning. The conductive layer 134 can be formed by afilm formation method such as a PVD method or a CVD method. Examples ofa material for the conductive layer 134 include a conductive materialsuch as molybdenum, titanium, chromium, tantalum, tungsten, aluminum,copper, neodymium, and scandium, an alloy of any of these, and acompound containing any of these (e.g., nitride of any of these).

Specifically, for example, the conductive layer 134 can be formed asfollows: a titanium film is formed to have a small thickness by a PVDmethod in a region including the openings and a titanium nitride film isthen formed to have a small thickness by a CVD method; and then, atungsten film is formed so as to fill the openings. Here, the titaniumfilm formed by a PVD method has a function of reducing an oxide film(e.g., a natural oxide film) formed on a surface over which the titaniumfilm is formed, to decrease the contact resistance with the lowerelectrodes (here, the source or drain electrode 130 a, the source ordrain electrode 130 b or the like). In addition, the subsequently formedtitanium nitride film has a barrier property such that diffusion of aconductive material is prevented. Further, after a barrier film isformed using titanium, titanium nitride or the like, a copper film maybe formed by a plating method.

After the conductive layer 134 is formed, part of the conductive layer134 is removed by etching treatment, CMP or the like so that theinsulating layer 132 is exposed and the electrodes 136 a, 136 b and thegate electrode 136 c are formed (see FIG. 4C). Note that when theelectrodes 136 a, 136 b and the gate electrode 136 c are formed byremoving part of the above conductive layer 134, processing ispreferably performed so that flattened surfaces are obtained. Byflattening surfaces of the insulating layer 132, the electrodes 136 a,136 b and the gate electrode 136 c, favorable electrodes, wirings,insulating layers, semiconductor layers and the like can be formed in asubsequent step.

After that, the gate insulating layer 138 is formed so as to cover theinsulating layer 132, the electrodes 136 a, 136 b and the gate electrode136 c (see FIG. 4D). The gate insulating layer 138 can be formed by asputtering method, a CVD method or the like. The gate insulating layer138 preferably contains silicon oxide, silicon nitride, siliconoxynitride, aluminum oxide, hafnium oxide, tantalum oxide or the like.Note that the gate insulating layer 138 may have a single-layerstructure or a stacked-layer structure. There is no particularlimitation on the thickness of the gate insulating layer 138, but thethickness can be 10 nm or more and 500 nm or less, for example. When astacked-layer structure is employed, the gate insulating layer 138 ispreferably formed by stacking a first gate insulating layer with athickness 50 nm or more and 200 nm or less and a second gate insulatinglayer with a thickness 5 nm or more and 300 nm or less over the firstgate insulating layer.

Note that an oxide semiconductor which is made to be an intrinsic oxidesemiconductor or a substantially intrinsic oxide semiconductor byremoving an impurity (an oxide semiconductor which is highly purified)is extremely sensitive to an interface energy levels or to the electriccharges trapping at the interface; therefore, when such an oxidesemiconductor is used for an oxide semiconductor layer, an interfacebetween the oxide semiconductor layer and a gate insulating layer isimportant. Therefore, the gate insulating layer 138 which is to be incontact with the highly purified oxide semiconductor layer needs to beof high quality.

For example, a high-density plasma CVD method using microwave (2.45 GHz)is favorable because a dense and high-quality gate insulating layer 138having high withstand voltage can be formed thereby. In this manner, theinterface state can be reduced and interface characteristics can befavorable when the highly purified oxide semiconductor layer and thehigh quality gate insulating layer are in contact with each other.

Needless to say, even when such a highly purified oxide semiconductorlayer is used, another method such as a sputtering method or a plasmaCVD method can be employed as long as an insulating layer having goodquality can be formed as the gate insulating layer. Alternatively, aninsulating layer whose film quality and interface characteristics withan oxide semiconductor layer are modified by heat treatment after beingformed may be applied. In any case, the gate insulating layer 138 whichis of good quality and which is capable of reducing interface state withthe oxide semiconductor layer may be formed.

Next, an oxide semiconductor layer is formed over the gate insulatinglayer 138 and processed by a method such as etching using a mask so thatthe oxide semiconductor layer 140 having an island-shape is formed (seeFIG. 4E).

The oxide semiconductor layer is preferably formed using a sputteringmethod. For the formation of the oxide semiconductor layer, anIn—Sn—Ga—Zn—O-based oxide semiconductor layer which is a four-componentmetal oxide; an In—Ga—Zn—O-based oxide semiconductor layer, anIn—Sn—Zn—O-based oxide semiconductor layer, an In—Al—Zn—O-based oxidesemiconductor layer, a Sn—Ga—Zn—O-based oxide semiconductor layer, anAl—Ga—Zn—O-based oxide semiconductor layer or a Sn—Al—Zn—O-based oxidesemiconductor layer which are three-component metal oxide; anIn—Zn—O-based oxide semiconductor layer, a Sn—Zn—O-based oxidesemiconductor layer, an Al—Zn—O-based oxide semiconductor layer, aZn—Mg—O-based oxide semiconductor layer, a Sn—Mg—O-based oxidesemiconductor layer or an In—Mg—O-based oxide semiconductor layer whichare two-component metal oxide; or an In—O-based oxide semiconductorlayer, a Sn—O-based oxide semiconductor layer or a Zn—O-based oxidesemiconductor layer which are single-component metal oxide can be used.Note that silicon may be added to a metal oxide. For example, the oxidesemiconductor layer may be formed using a target containing SiO₂ at 2 wt% or more and 10 wt % or less.

Among them, when an In—Ga—Zn—O-based metal oxide is used, asemiconductor device having sufficiently high resistance andsufficiently reduced off state current when there is no electric field,or a semiconductor device having high field effect mobility can beformed. Therefore, an In—Ga—Zn—O-based metal oxide is preferable for asemiconductor material used for a semiconductor device.

As a typical example of the In—Ga—Zn—O-based metal oxide semiconductor,one represented by InGaO₃(ZnO)_(m) (m>0) is given. In addition, onerepresented by InMO₃(ZnO)_(m) (m>0) is given using M instead of Ga.Here, M denotes one or more of metal elements selected from gallium(Ga), aluminum (Al), iron (Fe), nickel (Ni), manganese (Mn), cobalt (Co)and the like. For example, M can be Ga, Ga and Al, Ga and Fe, Ga and Ni,Ga and Mn, Ga and Co or the like. Note that the above describedcomposition is derived from a crystal structure and is just an example.

In this embodiment, the oxide semiconductor layer is formed by asputtering method using a target for forming an In—Ga—Zn—O-based oxidesemiconductor.

For the film formation of the oxide semiconductor layer, a substrate isset in a chamber at reduced pressure and the substrate temperature ispreferably set 100° C. or higher and 600° C. or lower, more preferably200° C. or higher and 400° C. or lower. Here, forming the oxidesemiconductor layer while heating the substrate reduces theconcentration of impurities contained in the oxide semiconductor layerand reduces damage to the oxide semiconductor layer due to sputtering.

Then, moisture remaining in the treatment chamber is removed at the sametime as the introduction of a sputtering gas from which hydrogen, waterand the like are removed into the treatment chamber where a metal oxideis used as a target, thereby forming an oxide semiconductor layer. Anatmosphere for film formation of the oxide semiconductor layer ispreferably a rare gas (typically argon) atmosphere, an oxygen atmosphereor a mixed atmosphere of a rare gas (typically argon) and oxygen.Specifically, a high-purity gas atmosphere is preferable in which theconcentration of impurities such as hydrogen, water, hydroxyl andhydride is reduced to a concentration of approximately several parts permillion (preferably several parts per billion).

Here, in order to remove remaining moisture in the treatment chamber, anentrapment vacuum pump is preferably used. For example, a cryopump, anion pump, or a titanium sublimation pump can be used. The evacuationunit may be a turbo pump provided with a cold trap. A hydrogen atom, acompound containing a hydrogen atom, such as water (H₂O) (and alsopreferably a compound containing a carbon atom) or the like is removedfrom a deposition chamber which is evacuated with the cryopump, so thatthe concentration of impurities contained in the oxide semiconductorlayer formed in the deposition chamber can be reduced.

The oxide semiconductor layer is formed to have a thickness of 2 nm ormore and 200 nm or less, preferably 5 nm or more and 30 nm or less. Notethat an appropriate thickness depends on an applied oxide semiconductormaterial, and the thickness of the oxide semiconductor layer may be setas appropriate depending on the material.

Further, when a pulse direct current (DC) power supply is used forforming the oxide semiconductor layer, powder substances (also referredto as particles or dust) generated in film formation can be reduced andthe film thickness can be uniform.

The oxide semiconductor layer can be formed using a sputtering methodunder the following conditions, for example: the distance between thesubstrate and the target is 170 mm; the pressure is 0.4 Pa; the directcurrent (DC) power supply is 0.5 kW; and the atmosphere is oxygen (theflow rate ratio of oxygen is 100%).

Note that before the oxide semiconductor layer is formed by a sputteringmethod, dust attached to a surface of the gate insulating layer 138 ispreferably removed by reverse sputtering in which an argon gas isintroduced and plasma is generated. Here, the reverse sputtering means amethod for improving the quality of a surface of the object to beprocessed by ions striking on the surface, while general sputtering isachieved by ions striking on a sputtering target. Methods for makingions strike the surface of the object to be processed include a methodin which a high frequency voltage is applied on the surface in an argonatmosphere and plasma is generated in the vicinity of the substrate.Note that a nitrogen atmosphere, a helium atmosphere, an oxygenatmosphere or the like may be used instead of the argon atmosphere.

For the etching of the oxide semiconductor layer, either dry etching orwet etching may be used. Needless to say, a combination of dry etchingand wet etching may be employed. The etching conditions (an etching gas,etching solution, etching time, temperature or the like) may be set asappropriate, depending on the material so that the oxide semiconductorlayer can be etched into a desired shape.

Examples of the etching gas for dry etching are a gas containingchlorine (a chlorine-based gas such as chlorine (Cl₂), boron trichloride(BCl₃), silicon tetrachloride (SiCl₄) or carbon tetrachloride (CCl₄))and the like. Alternatively, a gas containing fluorine (a fluorine-basedgas such as carbon tetrafluoride (CF₄), sulfur hexafluoride (SF₆),nitrogen trifluoride (NF₃) or trifluoromethane (CHF₃)); hydrogen bromide(HBr); oxygen (O₂); any of these gases to which a rare gas such ashelium (He) or argon (Ar) is added; or the like may be used.

As a dry etching method, a parallel plate reactive ion etching (RIE)method or an inductively coupled plasma (ICP) etching method can beused. In order to etch the layer into a desired shape, the etchingconditions (the amount of electric power applied to a coil-shapedelectrode, the amount of electric power applied to an electrode on asubstrate side, the temperature of the electrode on the substrate sideor the like) are set as appropriate.

As an etchant used for wet etching, a mixed solution of phosphoric acid,acetic acid and nitric acid or the like can be used. An etchant such asITO07N (produced by KANTO CHEMICAL CO., INC.) may also be used.

Next, the oxide semiconductor layer is preferably subjected to firstheat treatment. By this first heat treatment, the oxide semiconductorlayer can be dehydrated or dehydrogenated. The first heat treatment isperformed at a temperature 300° C. or higher and 750° C. or lower,preferably 400° C. or higher and 700° C. or lower. For example, thesubstrate is introduced into an electric furnace using a resistanceheating element or the like and the oxide semiconductor layer 140 issubjected to heat treatment in a nitrogen atmosphere at a temperature of450° C. for an hour. During this time, the oxide semiconductor layer 140is prevented from being exposed to the air so that entry of hydrogen(including water and the like) is prevented.

Note that a heat treatment apparatus is not limited to an electricalfurnace, and may include a device for heating an object to be processedby heat conduction or heat radiation given by a medium such as a heatedgas or the like. For example, a rapid thermal anneal (RTA) apparatussuch as a lamp rapid thermal anneal (LRTA) apparatus or a gas rapidthermal anneal (GRTA) apparatus can be used. An LRTA apparatus is anapparatus for heating an object to be processed by radiation of light(an electromagnetic wave) emitted from a lamp such as a halogen lamp, ametal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressuresodium lamp or a high pressure mercury lamp. A GRTA apparatus is anapparatus for heat treatment using a high-temperature gas. As the gas,an inert gas which does not react with an object to be processed by heattreatment, such as nitrogen or a rare gas such as argon is used.

For example, as the first heat treatment, GRTA treatment may beperformed as follows. The substrate is placed in an inert gas which hasbeen heated to a high temperature of 650° C. to 700° C., heated forseveral minutes, and taken out from the inert gas. GRTA treatmentenables high-temperature heat treatment for a short time. Moreover, inthe case where a substrate having low heat resistance such as a glasssubstrate or the like is used, such heat treatment is applicable evenwhen a temperature exceeds the strain point of the substrate because ittakes only short time.

Note that the first heat treatment is preferably performed in anatmosphere which contains nitrogen or a rare gas (such as helium, neonor argon) as its main component and does not contain water, hydrogen orthe like. For example, the purity of nitrogen or a rare gas (such ashelium, neon or argon) introduced into the heat treatment apparatus is6N (99.9999%) or more, preferably 7N (99.99999%) or more (that is, theconcentration of impurities is 1 ppm or less, preferably 0.1 ppm orless).

In some cases, the oxide semiconductor layer might be crystallized to bean oxide semiconductor layer including a crystal depending on thecondition of the first heat treatment or the material of the oxidesemiconductor layer. Further, depending on the condition of the firstheat treatment or the material of the oxide semiconductor layer, theoxide semiconductor layer may become an amorphous oxide semiconductorlayer containing no crystalline component.

In addition, electric characteristics of the oxide semiconductor layercan be changed by providing a crystal layer over the amorphous surface.For example, the electric characteristics of the oxide semiconductorlayer can be changed by forming a crystal layer in which a crystal grainhaving electrical anisotropy is aligned. Such a crystal layer may bereferred to as a plate-like crystal according to its shape.

The first heat treatment performed on the oxide semiconductor layer 140can be performed on the oxide semiconductor layer which has not yet beenprocessed into the island-shaped oxide semiconductor layer 140. In thatcase, after the first heat treatment, the substrate is taken out of theheating apparatus and a photolithography step is performed.

Note that the first heat treatment can dehydrogenate (dehydrate) theoxide semiconductor layer 140 and thus can be called dehydrogenationtreatment (dehydration treatment). It is possible to perform suchtreatment at any timing, for example, after the oxide semiconductorlayer is formed, after the source electrode or the drain electrode isstacked over the oxide semiconductor layer 140 or after a protectiveinsulating layer is formed over the source and drain electrodes. Suchtreatment may be performed more than once.

In addition, in the case where an oxide semiconductor layer in whichhydrogen is sufficiently reduced can be obtained by controlling a filmformation atmosphere or the like, the first heat treatment can beomitted.

Next, the source or drain electrode 142 a and the source or drainelectrode 142 b are formed in contact with the oxide semiconductor layer140 (see FIG. 4F). The source or drain electrode 142 a and the source ordrain electrode 142 b can be formed in such a manner that a conductivelayer is formed so as to cover the oxide semiconductor layer 140 andthen selectively etched. Note that in some cases, the oxidesemiconductor layer 140 is partly etched in this step and thus has agroove portion (a recessed portion) depending on the materials and theetching conditions.

The conductive layer can be formed by a PVD method such as a sputteringmethod, a CVD method such as a plasma CVD method. As a material of theconductive layer, an element selected from aluminum, chromium, copper,tantalum, titanium, molybdenum and tungsten, an alloy containing any ofthe above elements as its component or the like can be used. Further, amaterial containing one or more elements selected from manganese,magnesium, zirconium, beryllium and thorium as a component may be used.A material in which aluminum and one or more elements selected fromtitanium, tantalum, tungsten, molybdenum, chromium, neodymium andscandium are combined is also applicable to the material of theconductive layer. The conductive layer may have either a single-layerstructure or a stacked-layer structure of two or more layers. Forexample, a single-layer structure of an aluminum film containingsilicon, a two-layer structure of an aluminum film and a titanium filmstacked thereover, a three-layer structure in which a titanium film, analuminum film and a titanium film are stacked in this order and the likecan be given.

Alternatively, the conductive layer may be formed using conductive metaloxide. As conductive metal oxide, indium oxide (In₂O₃), tin oxide(SnO₂), zinc oxide (ZnO), indium oxide-tin oxide alloy (In₂O₃—SnO₂,which is abbreviated to ITO in some cases), indium oxide-zinc oxidealloy (In₂O₃—ZnO) or any of these metal oxide materials in which siliconor silicon oxide is contained can be used.

The channel length (L) of the transistor is determined by a distancebetween a lower edge portion of the source or drain electrode 142 a anda lower edge portion of the source or drain electrode 142 b. In the casewhere exposure in which the channel length (L) is less than 25 nm,exposure to make a mask for etching may be performed in the extremeultraviolet range of several nanometers to several tens of nanometerswhich is extremely short wavelength. In the exposure using extremeultraviolet light, the resolution is high and the focus depth is large.Therefore, the channel length (L) of the transistor to be formed can be10 nm or more and 1000 nm or less, whereby operation speed of a circuitcan be increased and power consumption can be reduced.

Note that plasma treatment using a gas such as N₂O, N₂ or Ar ispreferably performed after the above step. By this plasma treatment,water and the like attached to a surface of the oxide semiconductorlayer which is exposed is removed. Alternatively, plasma treatment maybe performed using a gas containing oxygen such as a mixed gas of oxygenand argon. In this manner, the oxide semiconductor layer is suppliedwith oxygen and defect level in energy gap due to oxygen deficiency canbe reduced.

After that, the protective insulating layer 144 which is in contact withpart of the oxide semiconductor layer 140 is formed without exposure tothe air (see FIG. 4G).

The protective insulating layer 144 can be formed by appropriatelyemploying a method such as a sputtering method, by which an impuritysuch as hydrogen or water is prevented from entering the protectiveinsulating layer 144. The protective insulating layer 144 is formed tohave a thickness 1 nm or more. As a material which can be used for theprotective insulating layer 144, there are silicon oxide, siliconnitride, silicon oxynitride and the like. The protective insulatinglayer 144 may have a single-layer structure or a stacked-layerstructure. The substrate temperature for formation of the protectiveinsulating layer 144 is preferably room temperature or higher and 300°C. or lower, preferably a rare gas (typically argon) atmosphere, anoxygen atmosphere or a mixed atmosphere of a rare gas (typically argon)and oxygen.

When hydrogen is contained in the protective insulating layer 144, entryof the hydrogen to the oxide semiconductor layer 140, extraction ofoxygen in the oxide semiconductor layer 140 by the hydrogen or the likeis caused, and the resistance of the backchannel side of the oxidesemiconductor layer 140 is made low, which may form a parasitic channel.Therefore, it is preferable that a formation method in which hydrogen isnot used be employed so that the protective insulating layer 144contains hydrogen as less as possible.

For example, in the case where the protective layer 144 is formed by asputtering method, as a sputtering gas, a high-purity gas from which aconcentration of an impurity such as hydrogen, water, hydroxyl orhydride is reduced to approximately several parts per million(preferably several parts per billion) is used. In addition, moistureremaining in a treatment chamber is preferably removed.

In this embodiment, as a protective insulating layer 144, an insulatinglayer containing silicon oxide is formed by a sputtering method.

Next, second heat treatment (preferably at a temperature 200° C. orhigher and 400° C. or lower, for example, 250° C. or higher and 350° C.or lower) in an inert gas atmosphere or an oxygen atmosphere ispreferably performed. For example, the second heat treatment isperformed in a nitrogen atmosphere at 250° C. for an hour. The secondheat treatment can reduce variation in the electric characteristics ofthe transistor. Further, by the second heat treatment, oxygen issupplied from an insulating layer containing oxygen to the oxidesemiconductor layer and defect level in energy gap due to oxygendeficiency can be reduced. Note that an atmosphere of the second heattreatment is not limited to the above described atmosphere and may be anair atmosphere or the like. In this case, hydrogen, water and the likemay be preferably removed from the atmosphere so that hydrogen is notincluded in the oxide semiconductor layer. Furthermore, the second heattreatment is not an absolutely necessary step, whereby the second heattreatment can be omitted.

Then, the interlayer insulating layer 146 is formed over the protectiveinsulating layer 144 (see FIG. 5A). The interlayer insulating layer 146can be formed by a PVD method, a CVD method or the like. A materialcontaining an inorganic insulating material such as silicon oxide,silicon oxynitride, silicon nitride, hafnium oxide, aluminum oxide ortantalum oxide can be used for the interlayer insulating layer 146.Further, a surface of the interlayer insulating layer 146 is preferablysubjected to CMP, etching or the like so as to be flattened after theinterlayer insulating layer 146 is formed.

Next, openings reaching the electrodes 136 a and 136 b, the source ordrain electrode 142 a and the source or drain electrode 142 b are formedin the interlayer insulating layer 146, the protective insulating layer144, and the gate insulating layer 138; then, a conductive layer 148 isformed so as to fill the openings (see FIG. 5B). The above openings canbe formed by etching with the use of a mask, for example. The mask canbe formed by exposure using a photomask, for example. For the etching,either wet etching or dry etching may be performed but dry etching ispreferable in view of the fine patterning. Materials used for theconductive layer 148, a method for forming the conductive layer 148 andthe like is the same as that of the conductive layer 134, so thatdescription about the conductive layer 134 can be referred to for thedetails.

After the conductive layer 148 is formed, part of the conductive layer148 is removed by etching, CMP or the like so that the interlayerinsulating layer 146 is exposed and the electrodes 150 a, 150 b, 150 cand 150 d are formed (see FIG. 5C). Note that when the electrodes 150 a,150 b, 150 c and 150 d are formed by removing part of the aboveconductive layer 148, processing is preferably performed to obtainflattened surfaces. By flattening surfaces of the interlayer insulatinglayer 146 and the electrodes 150 a, 150 b, 150 c and 150 d, favorableelectrodes, wirings, insulating layers, semiconductor layers, and thelike can be formed in a subsequent step.

After that, the insulating layer 152 is formed. In the insulating layer152, openings reaching the electrodes 150 a, 150 b, 150 c and 150 d areformed. Then, a conductive layer is formed so as to be embedded in theopenings. After that, part of the conductive layer is removed byetching, CMP or the like so that the insulating layer 152 is exposed andthe electrodes 154 a, 154 b and 154 c are formed (see FIG. 5D). Thisstep is similar to that of the electrode 136 a, the electrode 150 a andthe like; therefore, detailed description is omitted here.

When the transistor 162 is manufactured in the above-described manner,the hydrogen concentration of the oxide semiconductor layer 140 is5×10¹⁹ atoms/cm³ or less, preferably 5×10¹⁸ atoms/cm³ or less, morepreferably 5×10¹⁷ atoms/cm³ or less. The off state current of thetransistor 162 is 1×10⁻¹³ A or less and the off resistivity is 1×10⁹ Ω·mor more (alternatively, 1×10¹⁰ Ω·m or more). Thus, the transistor 162having excellent characteristics can be obtained by employing the highlypurified oxide semiconductor layer in which the hydrogen concentrationis sufficiently reduced and defect level in energy gap due to oxygendeficiency are reduced.

Note that in this embodiment, a semiconductor device related to astacked-layer structure of a transistor using a material other than anoxide semiconductor and a transistor using an oxide semiconductor;however, a structure which can be used in the disclosed invention is notlimited to the stacked-layer structure. A single-layer structure, astacked-layer structure of two or more layers may be used. For example,since the field effect mobility of an oxide semiconductor is relativelyhigh, a semiconductor device can have a single-layer structure or astacked-layer structure using only an oxide semiconductor as asemiconductor material. In particular, in the case where an oxidesemiconductor having a crystal structure is used, field effect mobilityμ can be μ>100 cm²/V·s and a semiconductor device using only an oxidesemiconductor can be realized. Further, in this case, a semiconductordevice can be formed using a substrate such as a glass substrate or thelike.

Furthermore, an arrangement and a connection relation of an electrode (awiring), an insulating layer, a semiconductor layer and the like,various parameters such as a width of a wiring, a channel width, achannel length and the other conditions can be changed as appropriate inaccordance with a function required for a semiconductor integratedcircuit. For example, a structure of an electrode, a wiring and the likeof a semiconductor device having a single-layer structure is greatlydifferent from that of a semiconductor device having a stacked-layerstructure.

The structures, methods and the like described in this embodiment can becombined as appropriate with any of the structures, methods and the likedescribed in the other embodiments.

Embodiment 2

In this embodiment, a semiconductor device having a differentconfiguration from that of the semiconductor device shown in the aboveembodiment is described with reference to FIGS. 6A and 6B and FIG. 7.

<Circuit Configuration and Operation of Semiconductor Device>

FIGS. 6A and 6B show an example of a circuit configuration of asemiconductor device according to this embodiment. FIG. 6A is an exampleof a semiconductor device using a CMOS inverter circuit which is thesimplest CMOS circuit. FIG. 6B is an example of a semiconductor devicehaving a plurality of CMOS inverter circuits.

A difference between the semiconductor devices shown in FIGS. 6A and 6Band the semiconductor devices shown in FIGS. 1A and 1B is whether theswitching transistor S1 using an oxide semiconductor has a back gate ornot. In the semiconductor device shown in FIGS. 6A and 6B, the switchingtransistor S1 has a back gate, so that the threshold voltage of theswitching transistor S1 can be controlled by controlling a potential ofthe back gate. Consequently, an off state leakage current can be easilyreduced to the value which can be considered substantially zero.

In this embodiment, since the switching transistor S1 has the back gateas described above, there are two control terminals: control terminalS_IN_1 and control terminal S_IN_2. Similar to the foregoing embodiment,a high potential or a low potential is input to the control terminalS_IN_1, whereby the switching transistor S1 is switched on and off. Thevalue of a potential input to the control terminal S_IN_2 is notparticularly limited as long as it is a potential to make a thresholdvoltage of the switching transistor S1 be a desired value. A constantpotential or a fluctuating potential may be input to the controlterminal S_IN_2. In addition, a potential like a ground potential may beemployed.

The other configuration, operation and the like are the same as those inthe foregoing embodiment; thus, a description thereof is omitted.

<Planar Structure and Cross-sectional Structure of Semiconductor Device>

FIG. 7 is an example of a structure (a cross-section) of thesemiconductor device shown in FIG. 6A. The semiconductor device shown inFIG. 7 includes a transistor 160 using a material other than oxidesemiconductor in a lower portion (a transistor included in a CMOSinverter circuit C1), and a transistor 162 using an oxide semiconductorin an upper portion (a transistor functioning as the switchingtransistor S1). At this point, the semiconductor device shown in FIG. 7is in common with the semiconductor device shown in FIG. 2A. Adifference between the semiconductor device shown in FIG. 2A and thesemiconductor device shown in FIG. 7 is whether a gate electrode 145 isprovided or not in addition to the gate electrode 136 c.

The details of each component are the same as those of the semiconductordevice shown in the foregoing embodiment. The gate electrode 145provided in the region over the protective insulating layer 144 whichoverlaps with the oxide semiconductor layer 140 has a function ofgenerating an electric field which controls the threshold voltage of thetransistor 162. Thus, the off state leakage current of the transistor162 be easily suppressed to the value which can be consideredsubstantially zero. Note that a structure in which the transistor 162 isswitched on and off by the gate electrode 136 c and the thresholdvoltage is controlled by the gate electrode 145 is employed; however,the roles of the gate electrode 136 c and the gate electrode 145 can beinterchanged. In addition, the protective insulating layer 144 also hasa function of a gate insulating layer.

The structures, methods and the like shown in this embodiment can becombined as appropriate with any of the structures, methods and the likeshown in the other embodiments.

Embodiment 3

In this embodiment, an integrated semiconductor device which is anotherembodiment of the disclosed invention is described with reference toFIG. 8.

An integrated semiconductor device 170 which is a modification exampleof the semiconductor device shown in the foregoing embodiment (forexample, Embodiment 1) is shown in FIG. 8. Specific examples of theintegrated semiconductor device 170 are a CPU, an MPU and the like.

The semiconductor device 170 includes a plurality of circuit blocks suchas circuit blocks 171 to 174 and the like. In addition, the circuitblocks are electrically connected to each other through an element usingan oxide semiconductor at least in a part thereof such as a switchingelement 181, a switching element 182 and the like.

For the circuit blocks 171 to 174, an integrated circuit including theCMOS inverter circuits C1 to Cn and the like can be used, for example.Alternatively, a memory circuit or the like typified by DRAM may also beapplied. Each circuit blocks needs to have an appropriate functiondepending on the required properties.

For the switching element 181 and the switching element 182, theswitching transistor S1 can be used, for example. At least a part of theswitching element 181 and the switching element 182 are preferablyformed using an oxide semiconductor, particularly, a highly purifiedoxide semiconductor.

The semiconductor device 170 shown in FIG. 8 is only an example in whichthe configuration is simplified, and an actual semiconductor device mayhave various configurations depending on the uses.

At least a part of the semiconductor device 170 is formed using an oxidesemiconductor, particularly, a highly purified oxide semiconductor andstandby power thereof is sufficiently suppressed. As described in theforegoing embodiment, an effect of suppressing standby power in anintegrated and complicated semiconductor device is extremely large.

The structures, methods and the like shown in this embodiment can becombined as appropriate with any of the structures, methods and the likeshown in the other embodiments.

Embodiment 4

Next, another example of a method for manufacturing a transistor usingan oxide semiconductor which can be used as the switching transistor S1in the foregoing embodiment (such as Embodiment 1) is described withreference to FIGS. 9A to 9E. In this embodiment, the case where a highlypurified oxide semiconductor (specifically an oxide semiconductor havingan amorphous structure) is used is described in detail. Note thathereinafter, a top-gate transistor is described as an example but astructure of the transistor is not necessarily limited to a top-gatetransistor.

First, an insulating layer 202 is formed over a lower layer substrate200. Then an oxide semiconductor layer 206 is formed over the insulatinglayer 202 (see FIG. 9A).

For example, the lower layer substrate 200 can be a structure body in aportion lower than the interlayer insulating layer 128 in thesemiconductor device of the foregoing embodiment (the semiconductordevice shown in FIG. 2A and the like). The foregoing embodiment can bereferred to for the details.

The insulating layer 202 functions as a base and is formed in the samemanner as the gate insulating layer 138, the protective insulating layer144 and the like in the foregoing embodiment. The foregoing embodimentmay be referred to for a detailed description. Note that the insulatinglayer 202 is preferably formed containing as little hydrogen or water aspossible.

As the oxide semiconductor layer 206, an In—Sn—Ga—Zn—O-based oxidesemiconductor layer which is a four-component metal oxide; anIn—Ga—Zn—O-based oxide semiconductor layer, an In—Sn—Zn—O-based oxidesemiconductor layer, an In—Al—Zn—O-based oxide semiconductor layer, aSn—Ga—Zn—O-based oxide semiconductor layer, an Al—Ga—Zn—O-based oxidesemiconductor layer or a Sn—Al—Zn—O-based oxide semiconductor layerwhich are three-component metal oxide; an In—Zn—O-based oxidesemiconductor layer, a Sn—Zn—O-based oxide semiconductor layer, anAl—Zn—O-based oxide semiconductor layer, a Zn—Mg—O-based oxidesemiconductor layer, a Sn—Mg—O-based oxide semiconductor layer or anIn—Mg—O-based oxide semiconductor layer which are two-component metaloxide; or an In—O-based oxide semiconductor layer, a Sn—O-based oxidesemiconductor layer or a Zn—O-based oxide semiconductor layer which aresingle-component metal oxide can be used.

In particular, an In—Ga—Zn—O-based oxide semiconductor material hassufficiently high resistance when there is no electric field and thusoff state current can be sufficiently reduced. In addition, with highfield effect mobility, the In—Ga—Zn—O-based oxide semiconductor materialis suitable for a semiconductor device.

As the oxide semiconductor layer, a thin film represented byInMO₃(ZnO)_(m) (m>0 and m is not a natural number) can be used. Here, Mis one or more metal elements selected from Ga, Al, Mn and Co. Forexample, as M, Ga, Ga and Al, Ga and Mn, and Ga and Co are given. Amaterial represented by InGa_(x)Zn_(y)O_(z) can also be used. Here, x, yand z are given numbers. In addition, x, y, and z do not necessarily beintegers and may be non-integers. Note that x may be zero but y ispreferably not zero. For example, the expression InGa_(x)Zn_(y)O_(z)includes In—Zn—O in which x is zero. The oxide semiconductor materialrepresented by In—Ga—Zn—O described in this specification isInGaO₃(ZnO)_(m) (m>0 and m is not a natural number). The fact that m isnot a natural number can be confirmed by analysis using ICP-MS or RBS.Further, the expression InGa_(x)Zn_(y)O_(z) includes cases where x=1 andy=1, x=1 and y=0.5 and the like. Note that the above describedcomposition is derived from a crystal structure and is just an example.

In this embodiment, the oxide semiconductor layer 206 having anamorphous structure is formed by a sputtering method using a target forforming an In—Ga—Zn—O-based oxide semiconductor.

As a target for forming an In—Ga—Zn—O-based oxide semiconductor layer206 by a sputtering method, a target which can be represented by acompositional formula In:Ga:Zn=1:x:y (x is zero or more, y is 0.5 ormore and 5 or less) can be used. For example, a target with a relativeproportion of In:Ga:Zn=1:1:1 [atom ratio] (x=1, y=1), that is,In₂O₃:Ga₂O₃:ZnO=1:1:2[molar ratio] may be used. In addition, a targetwith a relative proportion of In:Ga:Zn=1:1:0.5 [atom ratio] (x=1,y=0.5), a target with a relative proportion of In:Ga:Zn=1:1:2 [atomratio] (x=1, y=2) or a target with a relative proportion ofIn:Ga:Zn=1:0:1 [atom ratio] (x=0, y=1) can also be used.

It is preferable that a metal oxide semiconductor contained in the oxidesemiconductor target for film formation has a relative density of 80% ormore, preferably 95% or more, more preferably 99.9% or more. With use ofa target for forming an oxide semiconductor with high relative density,the oxide semiconductor layer 206 having a dense structure can beformed.

An atmosphere for formation of the oxide semiconductor layer 206 ispreferably a rare gas (typically argon) atmosphere, an oxygen atmosphereor a mixed atmosphere of a rare gas (typically argon) and oxygen.Specifically, an atmosphere of a high-purity gas is preferable in whichthe concentration of impurities such as hydrogen, water, hydroxyl andhydride is reduced to a concentration of approximately several parts permillion (preferably several parts per billion).

At the time of forming the oxide semiconductor layer 206, for example,the substrate is fixed in a treatment chamber which is kept in areduced-pressure state and heated so that the substrate temperature is100° C. or higher and 600° C. or lower, preferably 200° C. or higher and400° C. or lower. While moisture remaining in the treatment chamber isremoved, a sputtering gas from which hydrogen, moisture and the like areremoved is introduced, and the oxide semiconductor layer 206 is formedwith use of the target. By forming the oxide semiconductor layer 206while the substrate is heated, the concentration of impurities containedin the oxide semiconductor layer 206 can be reduced. In addition, damageof the oxide semiconductor layer 206 due to sputtering is reduced. Inorder to remove remaining moisture in the treatment chamber, anentrapment vacuum pump is preferably used. For example, a cryopump, anion pump or a titanium sublimation pump can be used. The evacuation unitmay be a turbo pump provided with a cold trap. Hydrogen, water and thelike are removed from the deposition chamber by evacuating with thecryopump, so that the concentration of impurities contained in the oxidesemiconductor layer 206 can be reduced.

For example, the film formation conditions of the oxide semiconductorlayer 206 can be set as follows: the distance between a substrate and atarget is 170 mm; the pressure is 0.4 Pa; the direct-current (DC) poweris 0.5 kW; and the atmosphere is an oxygen atmosphere (the flow rateratio of oxygen is 100%) or an argon atmosphere (the flow rate ratio ofargon is 100%). It is preferable that a pulsed direct-current (DC) powersupply be used because powder substances (also referred to as particlesor dust) can be reduced and a variation of the film thickness can bedecreased. The thickness of the oxide semiconductor layer 206 is 2 nm ormore and 200 nm or less, preferably 5 nm or more and 30 nm or less. Notethat an appropriate thickness depends on an oxide semiconductor materialto be applied, the intended use of the semiconductor device or the like,and thus the thickness of the oxide semiconductor layer may be set asappropriate depending on the material to be used, the intended use orthe like.

Note that before the oxide semiconductor layer 206 is formed by asputtering method, a material attached to a surface of the insulatinglayer 202 is preferably removed by reverse sputtering in which an argongas is introduced and plasma is generated. Here, the reverse sputteringmeans a method for improving the quality of a surface of the object tobe processed by ions striking on the surface, while general sputteringis achieved by ions striking on a sputtering target. Methods for makingions strike the surface of the object to be processed include a methodin which a high frequency voltage is applied on the surface in an argonatmosphere and plasma is generated in the vicinity of the substrate.Note that a nitrogen atmosphere, a helium atmosphere, an oxygenatmosphere or the like may be used instead of the argon atmosphere.

Next, an island-shaped oxide semiconductor layer 206 a is formed byprocessing the oxide semiconductor layer 206 by an etching or the likewith use of a mask.

For the etching of the oxide semiconductor layer 206, either dry etchingor wet etching may be used. Needless to say, a combination of dryetching and wet etching may be employed. The etching conditions (anetching gas, etching solution, etching time, temperature or the like)may be set as appropriate, depending on the material so that the oxidesemiconductor layer can be etched into a desired shape. The foregoingembodiment can be referred to for a detailed description thereof. Theetching of the oxide semiconductor layer 206 can be performed in thesame manner as the etching of the semiconductor layer in the foregoingembodiment. The foregoing embodiment may be referred to for a detaileddescription.

After that, the oxide semiconductor layer 206 a is desirably subjectedto heat treatment (first heat treatment). Excessive hydrogen (includingwater and hydroxyl group) in the oxide semiconductor layer 206 a isremoved by the first heat treatment and a structure of the oxidesemiconductor is improved, so that defect level in energy gap of theoxide semiconductor layer 206 a can be reduced. The first heat treatmentis performed for example, at a temperature 300° C. or higher and 750° C.or lower, preferably 400° C. or higher and 700° C. or lower.

The first heat treatment can be performed in such a way that, forexample, the lower layer substrate 200 is introduced into an electricfurnace using a resistance heating element or the like and heated, undera nitrogen atmosphere at 450° C. for an hour. During the first heattreatment, the oxide semiconductor layer 206 a is not exposed to the airto prevent the entry of water and hydrogen.

Note that a heat treatment apparatus is not necessary limited to anelectrical furnace, and may include a device for heating an object to beprocessed by heat conduction or heat radiation given by a medium such asa heated gas or the like. For example, a rapid thermal anneal (RTA)apparatus such as a lamp rapid thermal anneal (LRTA) apparatus or a gasrapid thermal anneal (GRTA) apparatus can be used. An LRTA apparatus isan apparatus for heating an object to be processed by radiation of light(an electromagnetic wave) emitted from a lamp such as a halogen lamp, ametal halide lamp, a xenon arc lamp, a carbon arc lamp, a high pressuresodium lamp or a high pressure mercury lamp. A GRTA apparatus is anapparatus for heat treatment using a high-temperature gas. As the gas,an inert gas which does not react with an object to be processed by heattreatment, such as nitrogen or a rare gas such as argon is used.

For example, as the first heat treatment, GRTA treatment may beperformed as follows. The substrate is placed in an inert gas atmospherewhich has been heated to a high temperature of 650° C. to 700° C.,heated for several minutes, and taken out from the inert gas atmosphere.GRTA treatment enables high-temperature heat treatment for a short time.Moreover, the GRTA treatment can be employed even when the temperatureexceeds the upper temperature limit of the substrate because the heattreatment can be achieved in a short time. Note that the inert gas maybe switched to a gas including oxygen during the process. This isbecause defect level in energy gap due to oxygen deficiency can bereduced by performing the first heat treatment in an atmosphereincluding oxygen.

Note that the inert gas atmosphere is preferably an atmosphere whichcontains nitrogen or a rare gas (such as helium, neon or argon) as itsmain component and does not contain water, hydrogen or the like. Forexample, the purity of nitrogen or a rare gas such as helium, neon orargon introduced into a heat treatment apparatus is 6N (99.9999%) ormore, preferably 7N (99.99999%) or more (that is, the concentration ofthe impurities is 1 ppm or less, preferably 0.1 ppm or less).

In any case, impurities are reduced by the first heat treatment and ani-type or substantially i-type oxide semiconductor layer 206 a isformed, so that a transistor having excellent characteristics can berealized.

Note that the first heat treatment may be performed on the oxidesemiconductor layer 206 which has not yet been processed into theisland-shaped oxide semiconductor layer 206 a. In that case, after thefirst heat treatment, the lower layer substrate 200 is taken out of theheating apparatus and subjected to a photolithography step.

The first heat treatment has an effect of removing hydrogen, water andthe like and can be referred to as dehydration treatment,dehydrogenation treatment or the like. The dehydration treatment or thedehydrogenation treatment can be performed after a source electrode anda drain electrode are stacked over the oxide semiconductor layer 206 a.Further, such dehydration treatment or dehydrogenation treatment may beconducted once or plural times.

Next, a conductive layer is formed to be in contact with the oxidesemiconductor layer 206 a. The conductive layer is selectively etched,whereby a source or drain electrode 208 a and a source or drainelectrode 208 b are formed (see FIG. 9B). The step is the same as thestep relating to the source or drain electrode 142 a and the like. Theforegoing embodiment can be referred to for a detailed description.

Next, a gate insulating layer 212 which is in contact with part of theoxide semiconductor layer 206 a is formed (see FIG. 9C). The descriptionregarding the gate insulating layer 138 of the foregoing embodiment canbe referred to for a detailed description.

The formed gate insulating layer 212 is desirably subjected to secondheat treatment in an inert gas atmosphere or an oxygen atmosphere. Thesecond heat treatment is performed at a temperature 200° C. or higherand 450° C. or lower, preferably 250° C. or higher and 350° C. or lower.For example, the second heat treatment is performed at 250° C. for anhour in a nitrogen atmosphere. The second heat treatment can reducevariation in electric characteristics of the transistor. In addition, inthe case where the gate insulating layer 212 contains oxygen, oxygen issupplied to the oxide semiconductor layer 206 a and oxygen deficiency ofthe oxide semiconductor layer 206 a is filled, whereby an i-type oxidesemiconductor layer (an intrinsic semiconductor) or an oxidesemiconductor layer which is extremely close to an i-type can be formed.

Note that in this embodiment, the second heat treatment is performedafter the gate insulating layer 212 is formed; however, timing of thesecond heat treatment is not limited thereto.

Next, a gate electrode 214 is formed in a region over the gateinsulating layer 212 which overlaps with the oxide semiconductor layer206 a (see FIG. 9D). The gate electrode 214 can be formed after aconductive layer is formed over the gate insulating layer 212 and thenselectively patterned. The description regarding the gate electrode 136c and the gate electrode 145 of the foregoing embodiment can be referredto for a detailed description.

Next, an interlayer insulating layer 216 and an interlayer insulatinglayer 218 are formed over the gate insulating layer 212 and the gateelectrode 214 (see FIG. 9E). The interlayer insulating layer 216 and theinterlayer insulating layer 218 can be formed using a PVD method, a CVDmethod or the like. A material containing an inorganic insulatingmaterial such as silicon oxide, silicon oxynitride, silicon nitride,hafnium oxide, aluminum oxide or tantalum oxide can be used for theinterlayer insulating layer 216 and the interlayer insulating layer 218.Note that in this embodiment, a stacked-layer structure of theinterlayer insulating layer 216 and the interlayer insulating layer 218is employed but the disclosed invention is not limited thereto. Asingle-layer structure, a stacked layer structure of two layers may alsobe used.

Note that the interlayer insulating layer 218 is desirably formed so asto have a planarized surface. This is because an electrode, a wiring orthe like can be favorably formed over the interlayer insulating layer218 by forming the interlayer insulating layer 218 to have a planarizedsurface.

Through the above process, a transistor 250 using a highly purifiedoxide semiconductor layer 206 a is completed.

The transistor 250 shown in FIG. 9E includes the following components:the oxide semiconductor layer 206 a provided over the lower layersubstrate 200 with the insulating layer 202 interposed therebetween; thesource or drain electrode 208 a and the source or drain electrode 208 bboth of which are electrically connected to the oxide semiconductorlayer 206 a; the gate insulating layer 212 covering the oxidesemiconductor layer 206 a, the source or drain electrode 208 a and thesource or drain electrode 208 b; the gate electrode 214 over the gateinsulating layer 212; the interlayer insulating layer 216 over the gateinsulating layer 212 and the gate electrode 214; and the interlayerinsulating layer 218 over the interlayer insulating layer 216.

Since the oxide semiconductor layer 206 a is highly purified, thehydrogen concentration of the transistor 250 shown in this embodiment is5×10¹⁹ atoms/cm³ or less, preferably 5×10¹⁸ atoms/cm³ or less, morepreferably 5×10¹⁷ atoms/cm³ or less. In addition, the carrier density ofthe oxide semiconductor layer 206 a (for example, less than 1×10¹²/cm³,preferably less than 1.45×10¹⁰/cm³) is sufficiently less than that ofgeneral silicon wafer (approximately 1×10¹⁴/cm³). Because of this, theoff state current is sufficiently reduced. For example, in the casewhere a channel length is 10 μm and the thickness of an oxidesemiconductor layer is 30 nm, when the range of a drain voltage isapproximately 1 V to 10 V, the off state current (drain current of whena voltage between a gate and a source is 0 V or less) is 1×10⁻¹³ A orless. Furthermore, an off state current density (the value obtained bydividing the off state current with the channel width) at a roomtemperature is 100 aA (1 aA (attoampere) is 10⁻¹⁸ A (ampere))/μm orless, preferably 10 aA/μm or less, more preferably, 1 aA/μm or less.

Note that the characteristics of the transistor can be represented usingoff state resistance (resistance value when the transistor is turnedoff) or off state resistivity (resistivity when the transistor is turnedoff) besides off state current or off state current density. Here, offstate resistance R can be obtained by Ohm's law using off state currentand drain voltage. Further, off state resistivity p can be obtained byformula ρ=RA/L using a cross sectional area A of a channel formationregion and a channel length L. Specifically, in the above case, offstate resistivity is 1×10⁹ Ω·m or more (alternatively, 1×10¹⁰ Ω·m ormore). Note that the cross sectional area A is represented by A=dW usingthe thickness d of an oxide semiconductor layer and a channel width W.

When such a highly purified intrinsic oxide semiconductor layer 206 a isused, the off state current of the transistor can be sufficientlyreduced.

Note that in this embodiment, although the case where the transistor 250is used instead of the transistor 162 shown in the foregoing embodimentis described, the disclosed invention is not necessarily construed asbeing limited thereto. For example, an oxide semiconductor can be usedfor all transistors including a transistor included in an integratedcircuit by the electric characteristics being sufficiently increased. Insuch a case, the transistors do not need to be a stacked-layer structureas described in the foregoing embodiment. Note that field effectmobility t of a transistor including an oxide semiconductor ispreferably μ>100 cm²/V·s in order to realize favorable circuitoperation. In this case, the semiconductor device can be formed using aglass substrate or the like.

The structures, methods and the like shown in this embodiment can becombined as appropriate with any of the structures, methods and the likeshown in the other embodiments.

Embodiment 5

Next, an example of a method for manufacturing a transistor using anoxide semiconductor which can be used as the switching transistor S1 inthe foregoing embodiment (such as Embodiment 1) is described withreference to FIGS. 10A to 10E. In this embodiment, the case where afirst oxide semiconductor layer having a crystal region and a secondoxide semiconductor layer obtained by crystal growth from the crystalregion of the first oxide semiconductor layer are used as the oxidesemiconductor layer is described in detail. Note that hereinafter, atop-gate transistor is described as an example but a structure of thetransistor is not necessary limited to a top-gate transistor.

First, an insulating layer 302 is formed over a lower layer substrate300. After that, a first oxide semiconductor layer is formed over theinsulating layer 302 and first heat treatment is performed tocrystallize at least a region including a surface of the first oxidesemiconductor layer, so that a first oxide semiconductor layer 304 isformed (see FIG. 10A).

For example, the lower layer substrate 300 can be a structure body in aportion lower than the interlayer insulating layer 128 in thesemiconductor device of the foregoing embodiment (the semiconductordevice shown in FIG. 2A and the like). The foregoing embodiment can bereferred to for the details.

The insulating layer 302 functions as a base and is formed in the samemanner as the insulating layer 138, the protective insulating layer 144or the like in the foregoing embodiment. The foregoing embodiment may bereferred to for a detailed description. Note that the insulating layer302 is preferably formed containing as little hydrogen or water aspossible.

The first oxide semiconductor layer 304 can be formed in the same manneras the oxide semiconductor layer 206 in the foregoing embodiment. Theforegoing embodiment may be referred to for the details of the firstoxide semiconductor layer 304 and the film formation method thereof.Note that in this embodiment, the first oxide semiconductor layer 304 isintentionally crystallized by the first heat treatment; thus, a targetfor film formation of an oxide semiconductor which can be easilycrystallized is preferably used to form the first oxide semiconductorlayer 304. In addition, the thickness of the first oxide semiconductorlayer 304 is preferably 3 nm or more and 15 nm or less. In thisembodiment, the first oxide semiconductor layer 304 has a thickness of 5nm as an example. Note that an appropriate thickness differs dependingon an oxide semiconductor material to be applied, the intended use ofthe semiconductor device or the like, and thus the thickness is set asappropriate depending on the material to be used, the intended use orthe like.

The first heat treatment is performed at a temperature of 450° C. orhigher and 850° C. or lower, preferably 550° C. or higher and 750° C. orlower. The heat treatment is preferably performed for one minute or moreand 24 hours or less. The atmosphere of the first heat treatment ispreferably an atmosphere in which hydrogen, water and the like are notincluded. For example, the atmosphere can be a nitrogen atmosphere, anoxygen atmosphere, an atmosphere of a rare gas (such as helium, neon,and argon) or the like from which water is sufficiently removed.

For a heat treatment apparatus, a device for heating an object to beprocessed by heat conduction or heat radiation given by a medium such asa heated gas or the like can be used besides an electrical furnace. Forexample, a rapid thermal anneal (RTA) apparatus such as a lamp rapidthermal anneal (LRTA) apparatus or a gas rapid thermal anneal (GRTA)apparatus can be used. An LRTA apparatus is an apparatus for heating anobject to be processed by radiation of light (an electromagnetic wave)emitted from a lamp such as a halogen lamp, a metal halide lamp, a xenonarc lamp, a carbon arc lamp, a high pressure sodium lamp or a highpressure mercury lamp. A GRTA apparatus is an apparatus for heattreatment using a high-temperature gas. As the gas, an inert gas whichdoes not react with an object to be processed by heat treatment, such asnitrogen or a rare gas such as argon is used.

At least the region including the surface of the first oxidesemiconductor layer 304 is crystallized by the first heat treatment. Thecrystal grows from the surface of the first oxide semiconductor layer304 to the inside of the first oxide semiconductor layer 304, wherebythe crystal region is formed. Note that the crystal region contains aplate-like crystal whose average thickness is 2 nm or more and 10 nm orless, in some cases. In addition, the crystal region contains a crystalwhose c-axis is aligned a direction perpendicular to the surface of theoxide semiconductor layer, in some cases.

Further, it is preferable that hydrogen (including water and hydroxylgroup) and the like be removed from the first oxide semiconductor layer304 while the crystal region be formed by the first heat treatment. Inthe case where hydrogen and the like are removed, the first heattreatment may be performed in an atmosphere such as a nitrogenatmosphere, an oxygen atmosphere and an atmosphere of a rare gas (suchas helium, neon and argon) with a purity of 6N (99.9999%) or more (thatis, the concentration of the impurities is 1 ppm or less). Morepreferably, an atmosphere with a purity of 7N (99.99999%) or more (thatis, the concentration of the impurities is 0.1 ppm or less) may be used.Furthermore, the first heat treatment may be performed in ultra-dry airwith an H₂O concentration of 20 ppm or lower, preferably 1 ppm or lower.

In addition, it is preferable that oxygen be supplied to the first oxidesemiconductor layer 304 while the crystal region be formed by the firstheat treatment. For example, oxygen can be supplied to the first oxidesemiconductor layer 304 by changing the atmosphere of the heat treatmentto an oxygen atmosphere or the like.

In this embodiment, a heat treatment is performed at 700° C. for an hourunder a nitrogen atmosphere as the first heat treatment and hydrogen andthe like are removed from the oxide semiconductor layer. After that,oxygen is supplied to inside of the first oxide semiconductor layer 304by changing the atmosphere to an oxygen atmosphere. Note that a mainobject of the first heat treatment is a formation of the crystal region,so that another treatment whose object is removal of hydrogen and thelike and supply of oxygen can be additionally performed. For example, aheat treatment for crystallization can be performed after a heattreatment for removing hydrogen and the like and treatment for supplyingoxygen are performed.

The first oxide semiconductor layer 304 which has the crystal region andfrom which hydrogen (including water and hydroxyl group) and the likeare removed and to which oxygen is supplied can be obtained by suchfirst heat treatment.

Next, the second oxide semiconductor layer 306 is formed over the firstoxide semiconductor layer 304 having the crystal region at least in theregion including the surface (see, FIG. 10B).

The second oxide semiconductor layer 306 can be formed in the samemanner as the oxide semiconductor layer 206 in the foregoing embodiment.The foregoing embodiment may be referred to for the details of thesecond oxide semiconductor layer 306 and the film formation methodthereof. Note that the second oxide semiconductor layer 306 ispreferably formed to have a thickness larger than that of the firstoxide semiconductor layer 304. Further, it is preferable that the secondoxide semiconductor layer 306 be formed so that the sum of thethicknesses of the first oxide semiconductor layer 304 and the secondoxide semiconductor layer 306 is 3 nm or more and 50 nm or less. Notethat an appropriate thickness differs depending on an oxidesemiconductor material, the intended use or the like, and thus thethickness is set as appropriate depending on the material, the intendeduse or the like.

For the second oxide semiconductor layer 306, a material having the samemain component as that of the first oxide semiconductor layer 304, forexample, a material whose lattice constant after crystallization isclose to that of the first oxide semiconductor layer 304 (latticemismatch is 1% or less) is preferably used. This is because, in the casewhere the material having the same main component is used, a crystal canbe easily grown in crystallization of the second oxide semiconductorlayer 306 by using the crystal region of the first oxide semiconductorlayer 304 as a seed. Moreover, in the case where the material having thesame main component is used, physical properties of an interface andelectrical characteristics between the first oxide semiconductor layer304 and the second oxide semiconductor layer 306 are favorable.

Note that when a desired film quality is obtained by thecrystallization, a material having a different main component may beused to form the second oxide semiconductor layer 306.

Next, a second heat treatment is performed to the second oxidesemiconductor layer 306, so that the crystal is grown by using thecrystal region of the first oxide semiconductor layer 304 as a seed toform a second oxide semiconductor layer 306 a (see FIG. 10C).

The temperature of the second heat treatment is 450° C. or higher and850° C. or lower, preferably 600° C. or higher and 700° C. or lower. Thesecond heat treatment is performed for one minute or more and 100 hoursor less, preferably 5 hours or more and 20 hours or less and typically,for 10 hours. Note that it is preferable that also in the second heattreatment, hydrogen, water and the like be not contained in thetreatment atmosphere.

Details of the atmosphere and the effect of the heat treatment are thesame as that of the first heat treatment. A heat treatment apparatuswhich can be used is the same as that of the first heat treatment. Forexample, at the time of increasing the temperature of the second heattreatment, an atmosphere inside a furnace is set to a nitrogenatmosphere and at the time of performing cooling, the atmosphere of thefurnace is set to an oxygen atmosphere. Consequently, hydrogen and thelike can be removed under a nitrogen atmosphere and oxygen can besupplied under an oxygen atmosphere.

The second heat treatment as described the above is performed, wherebythe crystal is grown from the crystal region formed in the first oxidesemiconductor layer 304 to the whole area of the second oxidesemiconductor layer 306; thus, the second oxide semiconductor layer 306a can be formed. Further, the second oxide semiconductor layer 306 afrom which hydrogen (including water and hydroxyl group) is removed andto which oxygen is supplied can be formed. Furthermore, orientation ofthe crystal region of the first oxide semiconductor layer 304 can beincreased by performing second heat treatment.

For example, in the case where an In—Ga—Zn—O-based oxide semiconductormaterial is used for the second oxide semiconductor layer 306 a, thesecond oxide semiconductor layer 306 a can contain a crystal representedby InGaO₃(ZnO)_(m) (m>0 and m is not a natural number), a crystalrepresented by In₂Ga₂ZnO₇ (In:Ga:Zn:O=2:2:1:7) and the like. Suchcrystals are aligned so that its c-axis is perpendicular to a surface ofa second oxide semiconductor layer 306 b by the second heat treatment.

Here, the crystals include any of In, Ga and Zn, and can be consideredto have a stacked-layer structure of layers parallel to a-axis andb-axis. Specifically, the crystals have a structure in which a layercontaining In and a layer which does not containing In (a layercontaining Ga or Zn) are stacked in a direction of c-axis.

In an In—Ga—Zn—O-based oxide semiconductor crystal, conductivity in adirection parallel to a-axis and b-axis of a layer containing In isfavorable. This is due to the fact that electrical conductivity ismainly controlled by In in an In—Ga—Zn—O-based oxide semiconductorcrystal and the fact that the 5s orbital of one In atom overlaps withthe 5s orbital of an adjacent In atom and thereby a carrier path isformed.

Further, in the case where the first oxide semiconductor layer 304 has astructure including an amorphous region at an interface with theinsulating layer 302, the crystal grows from the crystal region formedat the surface of the first oxide semiconductor layer 304 toward abottom portion of the first oxide semiconductor layer 304 by the secondheat treatment, whereby the amorphous region is crystallized in somecases. Note that the amorphous region remains in some cases depending ona material included in the insulating layer 302, a condition of thesecond heat treatment or the like.

In the case where an oxide semiconductor material having the same maincomponent is used for the first oxide semiconductor layer 304 and thesecond oxide semiconductor layer 306, the first oxide semiconductorlayer 304 and the second oxide semiconductor layer 306 a have the samecrystal structure in some cases, as shown in FIG. 10C. Therefore,although boundary between the first oxide semiconductor layer 304 andthe second oxide semiconductor layer 306 a is indicated by a dotted linein FIG. 10C, the boundary cannot be found, therefore the first oxidesemiconductor layer 304 and the second oxide semiconductor layer 306 acan be regarded as the same layer in some cases.

Next, the first oxide semiconductor layer 304 and the second oxidesemiconductor layer 306 a are processed by a method such as an etchingusing a mask, so that an island-shaped first oxide semiconductor layer304 a and an island-shaped second oxide semiconductor layer 306 b areformed (see FIG. 10D).

For the etching of the first oxide semiconductor layer 304 and thesecond oxide semiconductor layer 306 a, either dry etching or wetetching may be used. Needless to say, a combination of dry etching andwet etching may be employed. The etching conditions (an etching gas,etching solution, etching time, temperature or the like) may be set asappropriate, depending on the material so that the oxide semiconductorlayer can be etched into a desired shape. The etching of the first oxidesemiconductor layer 304 and the second oxide semiconductor layer 306 acan be performed in the same manner as the etching of the semiconductorlayer in the foregoing embodiment. The foregoing embodiment may bereferred to for a detailed description.

Note that among the oxide semiconductor layer, a region to be a channelformation region preferably has a flat surface. For example, in a regionoverlapping with a gate electrode (the channel formation region), adifference in height of the surface of the second oxide semiconductorlayer 306 b is preferably 1 nm or less (more preferably, 0.2 nm orless).

Next, a conductive layer is formed so as to be in contact with thesecond oxide semiconductor layer 306 b. After that, the conductive layeris selectively etched, whereby a source or drain electrode 308 a and asource or drain electrode 308 b are formed (see, FIG. 10D). The sourceor drain electrodes 308 a and 308 b can be formed in the same manner asthat of the source or drain electrodes 142 a and 142 b in the foregoingembodiment. The foregoing embodiment may be referred to for a detaileddescription.

In some cases, during a step shown in FIG. 10D, a crystal layercontacting with the source or drain electrode 308 a and the source ordrain electrode 308 b becomes an amorphous state at the side surface ofthe first oxide semiconductor layer 304 a and the second oxidesemiconductor layer 306 b. Therefore, the whole region of the firstoxide semiconductor layer 304 a and the second oxide semiconductor layer306 b does not always have a crystal structure.

Subsequently, a gate insulating layer 312 contacting with part of thesecond oxide semiconductor layer 306 b is formed. The gate insulatinglayer 312 can be formed using a CVD method, sputtering method or thelike. After that, a gate electrode 314 is formed in a region over thegate insulating layer 312 which overlaps with the first oxidesemiconductor layer 304 a and the second oxide semiconductor layer 306b. An interlayer insulating layer 316 and an interlayer insulating layer318 are formed over the gate insulating layer 312 and the gate electrode314 (see FIG. 10E). The gate insulating layer 312, the gate electrode314 and the interlayer insulating layers 316 and 318 can be formed inthe same manner as the gate insulating layer 138, the gate electrode 136c, the gate electrode 145 and the interlayer insulating layers 216 and218 in the forgoing embodiment. The foregoing embodiment may be referredto for a detailed description.

The formed gate insulating layer 312 is desirably subjected to thirdheat treatment in an inert gas atmosphere or an oxygen atmosphere. Thethird heat treatment is performed at a temperature 200° C. or higher and450° C. or lower, preferably 250° C. or higher and 350° C. or lower. Forexample, the heat treatment is performed at 250° C. for an hour in anatmosphere containing oxygen. The third heat treatment can reducevariation in electric characteristics of the transistor. In addition, inthe case where the gate insulating layer 312 contains oxygen, oxygen issupplied to the second oxide semiconductor layer 306 b and oxygendeficiency of the second oxide semiconductor layer 306 b is filled,whereby an i-type (an intrinsic semiconductor) oxide semiconductor layeror an oxide semiconductor layer which is extremely close to an i-typecan be formed.

Note that in this embodiment, the third heat treatment is performedafter the gate insulating layer 312 is formed; however, timing of thethird heat treatment is not limited thereto. Alternatively, in the casewhere oxygen is already supplied to the second oxide semiconductor layerby another treatment such as the second heat treatment, the third heattreatment may be omitted.

In such a manner, a transistor 350 using the first oxide semiconductorlayer 304 a and the second oxide semiconductor layer 306 b obtained bycrystal growth from the crystal region of the first oxide semiconductorlayer 304 a is completed.

The transistor 350 shown in FIG. 10E includes the following components:the first oxide semiconductor layer 304 a provided over the lower layersubstrate 300 with the insulating layer 302 interposed therebetween; thesecond oxide semiconductor layer 306 b provided over the first oxidesemiconductor layer 304 a; the source or drain electrode 308 a and thesource or drain electrode 308 b are electrically connected to the secondoxide semiconductor layer 306 b; the gate insulating layer 312 coveringthe second oxide semiconductor layer 306 b, the source or drainelectrode 308 a and the source or drain electrode 308 b; the gateelectrode 314 over the gate insulating layer 312; the interlayerinsulating layer 316 over the gate insulating layer 312 and the gateelectrode 314; and the interlayer insulating layer 318 over theinterlayer insulating layer 316.

In the transistor 350 shown in this embodiment, since the first oxidesemiconductor layer 304 a and the second oxide semiconductor layer 306 bare highly purified, the hydrogen concentration is 5×10¹⁹ atoms/cm³ orless, preferably 5×10¹⁸ atoms/cm³ or less, and more preferably 5×10¹⁷atoms/cm³ or less. In addition, the carrier density of the oxidesemiconductor layer 206 a (for example, less than 1×10¹²/cm³, preferablyless than 1.45×10¹⁰/cm³) is sufficiently less than that of generalsilicon wafer (approximately 1×10¹⁴/cm³). Because of this, the off statecurrent is sufficiently reduced. For example, in the case where achannel length is 10 μm and the thickness of an oxide semiconductorlayer is 30 nm, when the range of a drain voltage is approximately 1 Vto 10 V, the off state current (drain current of when a voltage betweena gate and a source is 0 V or less) is 1×10⁻¹³ A or less. Furthermore,an off state current density (the value obtained by dividing the offstate current with the channel width) at a room temperature is 100 aA (1aA (attoampere) is 10⁻¹⁸ A (ampere))/μm or less, preferably 10 aA/m orless, more preferably, 1 aA/μm or less.

Note that the characteristics of the transistor can be represented usingoff state resistance (resistance value when the transistor is turnedoff) or off state resistivity (resistivity when the transistor is turnedoff) besides off state current or off state current density. Here, offstate resistance R can be obtained by Ohm's law using off state currentand drain voltage. Further, off state resistivity ρ can be obtained byformula ρ=RA/L using a cross sectional area A of a channel formationregion and a channel length L. Specifically, in the above case, offstate resistivity is 1×10⁹ Ω·m or more (alternatively, 1×10¹⁰ Ω·m ormore). Note that the cross sectional area A is represented by A=dW usingthe thickness d of an oxide semiconductor layer and a channel width W.

When such a highly purified intrinsic first oxide semiconductor layer304 a and the second oxide semiconductor layer 306 b are used, the offstate current of the transistor can be sufficiently reduced.

Further, in this embodiment, the first oxide semiconductor layer 304 aincluding the crystal region and the second oxide semiconductor layer306 b obtained by crystal growth from the crystal region of the firstoxide semiconductor layer 304 a are used as an oxide semiconductorlayer, whereby field effect mobility can be increased and a transistorhaving favorable electric characteristics can be realized.

Note that in this embodiment, the transistor 350 is used instead of thetransistor 162 shown in the foregoing embodiment is described; however,the disclosed invention is not necessary construed as being limitedthereto. For example, the transistor 350 shown in this embodiment usesthe first oxide semiconductor layer 304 a including the crystal regionand the second oxide semiconductor layer 306 b obtained by crystalgrowth from the crystal region of the first oxide semiconductor layer304 a, so that the transistor 350 has favorable field effect mobility.Therefore, an oxide semiconductor can be used for all transistorsincluding a transistor included in an integrated circuit. In such acase, the transistor does not need to be a stacked-layer structure asdescribed in the foregoing embodiment. Note that field effect mobility tof a transistor including an oxide semiconductor is preferably μ>100cm²/V·s in order to realize favorable circuit operation. In this case,the semiconductor device can be formed using a glass substrate or thelike.

The structures, methods and the like shown in this embodiment can becombined as appropriate with any of the structures, methods and the likeshown in the other embodiments.

Embodiment 6

In this embodiment, the case where the semiconductor device described inthe above embodiments is applied to electronic appliances is describedwith reference to FIGS. 11A to 11F. The case where the above describedsemiconductor device is applied to electronic appliances such as acomputer, a mobile phone set (also referred to as a mobile phone or amobile phone device), a personal digital assistant (including a portablegame machine, an audio reproducing device and the like), a digitalcamera, a digital video camera, electronic paper, a television set (alsoreferred to as a television or a television receiver) and the like isdescribed.

FIG. 11A shows a notebook personal computer including a housing 401, ahousing 402, a display portion 403, a keyboard 404 and the like. Thesemiconductor device shown in the foregoing embodiment is provided inthe housing 401 and the housing 402. Thus, a notebook PC withsufficiently low power consumption can be realized.

FIG. 11B shows a personal digital assistant (PDA) including a main body411 provided with a display portion 413, an external interface 415,operation button 414 and the like. A stylus 412 and the like operatingthe personal digital assistant are also provided. The semiconductordevice shown in the foregoing embodiment is provided in the main body411. Therefore, a personal digital assistant with sufficiently low powerconsumption can be realized.

FIG. 11C shows an e-book reader 420 with electronic paper attachedincluding two housings 421 and 423. The housings 421 and 423 areconnected by a hinge portion 437 and can be opened or closed with thehinge portion 437. With such a structure, the e-book reader can behandled like a paper book. The housing 421 is provided with a powerswitch 431, operation keys 433, a speaker 435 and the like. Thesemiconductor device shown in the foregoing embodiment is provided atleast in one of the housings 421 and 423. Therefore, an e-book readerwith sufficiently low power consumption can be realized.

FIG. 11D is a mobile phone set including two housings 440 and 441.Moreover, the housings 440 and 441 which are shown unfolded in FIG. 11Dcan overlap with each other by sliding. Thus, the mobile phone can be ina suitable size for portable use. The housing 441 includes a displaypanel 442, a speaker 443, a microphone 444, a pointing device 446, acamera lens 447, an external connection terminal 448 and the like. Thehousing 440 is provided with a solar cell 449 for charging the mobilephone, an external memory slot 450 and the like. In addition, an antennais incorporated in the housing 441. The semiconductor device shown inthe foregoing embodiment is provided at least in one of the housings 440and 441. Thus, a mobile phone set with sufficiently low powerconsumption can be realized.

FIG. 11E is a digital camera including a main body 461, a displayportion 467, an eyepiece portion 463, an operation switch 464, a displayportion 465, a battery 466 and the like. The semiconductor device shownin the foregoing embodiment is provided in the main body 461. Therefore,a digital camera with sufficiently low power consumption can berealized.

FIG. 11F is a television set 470 including a housing 471, a displayportion 473, a stand 475 and the like. The television set 470 can beoperated by an operation switch of the housing 471 and a separate remotecontroller 480. The semiconductor device shown in the foregoingembodiment is mounted in the housing 471 and the separate remotecontroller 480. Thus, a television set with sufficiently low powerconsumption can be realized.

As described above, an integrated circuit related to the foregoingembodiment is mounted in the electronic appliances shown in thisembodiment. Therefore, an electronic appliance whose standby power issufficiently reduced and power consumption is sufficiently reduced canbe realized.

This application is based on Japanese Patent Application serial no.2009-281949 filed with Japan Patent Office on Dec. 11, 2009, the entirecontents of which are hereby incorporated by reference.

The invention claimed is:
 1. A semiconductor device comprising: a firstpower supply terminal; a second power supply terminal; a firsttransistor comprising: a first gate electrode; a semiconductor layercomprising an oxide semiconductor material; and a first gate insulatinglayer between the first gate electrode and the semiconductor layer; aninverter circuit including a first terminal and a second terminal,wherein the inverter circuit comprises a second transistor, wherein achannel formation region of the second transistor comprises asemiconductor material other than the oxide semiconductor material,wherein the first power supply terminal is electrically connected to oneof a source terminal and a drain terminal of the first transistor,wherein the other of the source terminal and the drain terminal of thefirst transistor is electrically connected to the first terminal of theinverter circuit, and wherein the second terminal of the invertercircuit is electrically connected to the second power supply terminal.2. The semiconductor device according to claim 1, wherein the oxidesemiconductor material is an In—Ga—Zn—O-based oxide semiconductormaterial.
 3. The semiconductor device according to claim 1, wherein theoxide semiconductor material is one represented by InMO₃(ZnO)_(m) (m>0),wherein M denotes one or more of metal elements selected from gallium(Ga), aluminum (Al), iron (Fe), nickel (Ni), manganese (Mn), and cobalt(Co).
 4. The semiconductor device according to claim 1, wherein thesemiconductor material other than the oxide semiconductor material issilicon.
 5. The semiconductor device according to claim 1, furthercomprising a third transistor, wherein the second transistor is ann-channel transistor, and wherein the third transistor is a p-channeltransistor.
 6. A semiconductor device comprising: a first power supplyterminal; a second power supply terminal; a first transistor comprising:a first gate electrode; a first gate insulating layer over the firstgate electrode; a semiconductor layer comprising an oxide semiconductormaterial over the first gate insulating layer; a second gate insulatinglayer over the semiconductor layer; and a second gate electrode over thesecond gate insulating layer; an inverter circuit including a firstterminal and a second terminal, wherein the first power supply terminalis electrically connected to one of a source terminal and a drainterminal of the first transistor, wherein the other of the sourceterminal and the drain terminal of the first transistor is electricallyconnected to the first terminal of the inverter circuit, and wherein thesecond terminal of the inverter circuit is electrically connected to thesecond power supply terminal.
 7. The semiconductor device according toclaim 6, wherein the oxide semiconductor material is an In—Ga—Zn—O-basedoxide semiconductor material.
 8. The semiconductor device according toclaim 6, wherein the oxide semiconductor material is one represented byInMO₃(ZnO)_(m) (m>0), wherein M denotes one or more of metal elementsselected from gallium (Ga), aluminum (Al), iron (Fe), nickel (Ni),manganese (Mn), and cobalt (Co).
 9. The semiconductor device accordingto claim 6, wherein the inverter circuit comprises a second transistor,and wherein a channel formation region of the second transistorcomprises a semiconductor material other than the oxide semiconductormaterial.
 10. The semiconductor device according to claim 9, wherein thesemiconductor material other than the oxide semiconductor material issilicon.
 11. The semiconductor device according to claim 6, wherein theinverter circuit comprises a second transistor and a third transistor,wherein the second transistor is an n-channel transistor, and whereinthe third transistor is a p-channel transistor.
 12. A semiconductordevice comprising: a first power supply terminal; a second power supplyterminal; an inverter circuit including a first terminal and a secondterminal; an insulating layer over the inverter circuit; and a firsttransistor over the insulating layer, the first transistor comprising: afirst gate electrode; a semiconductor layer comprising an oxidesemiconductor material; and a first gate insulating layer between thefirst gate electrode and the semiconductor layer, wherein the firstpower supply terminal is electrically connected to one of a sourceterminal and a drain terminal of the first transistor, wherein the otherof the source terminal and the drain terminal of the first transistor iselectrically connected to the first terminal of the inverter circuit,and wherein the second terminal of the inverter circuit is electricallyconnected to the second power supply terminal.
 13. The semiconductordevice according to claim 12, wherein the semiconductor layer isprovided over the first gate electrode with the first gate insulatinglayer interposed therebetween, wherein the first transistor furthercomprises: a second gate insulating layer over the semiconductor layer;and a second gate electrode over the second gate insulating layer. 14.The semiconductor device according to claim 12, wherein the oxidesemiconductor material is an In—Ga—Zn—O-based oxide semiconductormaterial.
 15. The semiconductor device according to claim 12, whereinthe oxide semiconductor material is one represented by InMO₃(ZnO)_(m)(m>0), wherein M denotes one or more of metal elements selected fromgallium (Ga), aluminum (Al), iron (Fe), nickel (Ni), manganese (Mn), andcobalt (Co).
 16. The semiconductor device according to claim 12, whereinthe inverter circuit comprises a second transistor, and wherein achannel formation region of the second transistor comprises asemiconductor material other than the oxide semiconductor material. 17.The semiconductor device according to claim 16, wherein thesemiconductor material other than the oxide semiconductor material issilicon.
 18. The semiconductor device according to claim 12, wherein theinverter circuit is formed on a semiconductor substrate.
 19. Thesemiconductor device according to claim 12, wherein the insulating layercomprises silicon oxide, silicon oxynitride, silicon nitride, hafniumoxide, aluminum oxide, tantalum oxide, polyimide, and acrylic.